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SM32C6713BGDPA20EP

Texas Instruments

SM32C6713BGDPA20EP by Texas Instruments

Texas Instruments SM32C6713BGDPA20EP is a 32-bit DSP with 22-bit address bus, 32-bit external data bus, and 200 MHz clock frequency. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include integrated cache, multiple internal bus architecture, and boundary scan capability.

Median Price

$85.340

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$85.340

100+ parts

$75.990

1k+ parts

$68.160

10k+ parts

-

15

$85.340

$75.990

$68.160

-

DigiKey

USA . 194 parts In-Stock

1+ parts

$100.940

100+ parts

$76.570

1k+ parts

-

10k+ parts

-

194

$100.940

$76.570

-

-

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$78.380

1k+ parts

$70.130

10k+ parts

$66.010

4

-

$78.380

$70.130

$66.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 895 parts In-Stock

1+ parts

$71.944

100+ parts

-

1k+ parts

-

10k+ parts

-

895

$71.944

-

-

-

Vyrian

USA . 5,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,093

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 140 parts In-Stock

1+ parts

$56.171

100+ parts

-

1k+ parts

-

10k+ parts

-

140

$56.171

-

-

-

ChromeModa Solutions

Germany . 3,917 parts In-Stock

1+ parts

$63.114

100+ parts

$51.753

1k+ parts

-

10k+ parts

-

3,917

$63.114

$51.753

-

-

IDEA Electronic Components Group

UK . 549 parts In-Stock

1+ parts

$63.114

100+ parts

$59.958

1k+ parts

$56.803

10k+ parts

-

549

$63.114

$59.958

$56.803

-

Corphita

USA . 342 parts In-Stock

1+ parts

$68.157

100+ parts

-

1k+ parts

-

10k+ parts

-

342

$68.157

-

-

-

Component Stockers USA

USA . 35 parts In-Stock

1+ parts

$71.500

100+ parts

$71.120

1k+ parts

-

10k+ parts

-

35

$71.500

$71.120

-

-

Corohmni

South Africa . 98 parts In-Stock

1+ parts

$80.688

100+ parts

-

1k+ parts

-

10k+ parts

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98

$80.688

-

-

-

Microchip USA

USA . 4,386 parts In-Stock

1+ parts

$133.890

100+ parts

$131.560

1k+ parts

$130.390

10k+ parts

$129.230

4,386

$133.890

$131.560

$130.390

$129.230

Lixinc

USA . 15,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,500

-

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

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DigiPath Technology Company

USA . 1,596 parts In-Stock

1+ parts

-

100+ parts

$56.904

1k+ parts

-

10k+ parts

-

1,596

-

$56.904

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-

Kepictronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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120

-

-

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Resion (Excess)

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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40

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Overview

Experience the power of cutting-edge technology with the Texas Instruments SM32C6713BGDPA20EP, a top-of-the-line Digital Signal Processor designed for high-performance applications. With a reputation for exceptional quality and reliability, Texas Instruments leads the industry in innovation. Whether you're in need of advanced signal processing capabilities for automotive, industrial, or telecommunications applications, this DSP delivers unparalleled value and benefits to customers looking to stay ahead of the curve. Upgrade your systems with the SM32C6713BGDPA20EP and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides strong protection and durability for the DSP, ensuring a longer lifespan and reliability.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the DSP by storing frequently accessed data and instructions, reducing the need to fetch them from external memory.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for efficient performance and operation of the DSP under varying load conditions without the risk of voltage fluctuations impacting its functionality.

Address Bus Width: 22

A wider address bus width of 22 bits enables the DSP to access a larger memory space, facilitating faster data retrieval and processing for complex algorithms and computations.

Package Shape: SQUARE

Square package shape helps in efficient integration and mounting of the DSP onto circuit boards, saving space and ensuring a compact design for electronic devices.

Bit Size: 32

A higher bit size of 32 allows the DSP to perform complex mathematical operations and signal processing tasks with higher precision and accuracy.

Power Supplies (V): 1.25,3.3

Multiple power supply options including 1.25V and 3.3V ensure flexibility in powering the DSP according to the application requirements, offering compatibility with a wide range of systems.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6713BGDPA20EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.25,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

560 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SM32C6713BGDPA20EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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