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SM320LC31PQM40EP

Texas Instruments

SM320LC31PQM40EP by Texas Instruments

Texas Instruments SM320LC31PQM40EP is a 32-bit DSP with integrated cache, operating at 40 MHz. Ideal for military applications, it features low power mode, barrel shifter, and supports a 32-bit external data bus width.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 4,901 parts In-Stock

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Vyrian

USA . 4,341 parts In-Stock

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4,341

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Distributors (Availability)

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AZTECH Wire

Italy . 470 parts In-Stock

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$13.762

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470

$13.762

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One Stop Electronics

USA . 797 parts In-Stock

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$27.000

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797

$27.000

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Corohmni

South Africa . 4,885 parts In-Stock

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$33.863

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$33.863

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Parana Technologies

USA . 596 parts In-Stock

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$76.643

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$7,117.487

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$68.979

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596

$76.643

$7,117.487

$68.979

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DigiPath Technology Company

USA . 1,686 parts In-Stock

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$84.394

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1,686

$84.394

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ChromeModa Solutions

Germany . 4,731 parts In-Stock

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$86.116

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$70.615

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4,731

$86.116

$70.615

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IDEA Electronic Components Group

UK . 330 parts In-Stock

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$86.116

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$81.810

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$77.504

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330

$86.116

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$77.504

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Component Stockers USA

USA . 628 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,431 parts In-Stock

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Corphita

USA . 272 parts In-Stock

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Kepictronics

USA . 128 parts In-Stock

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Perfect Parts

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Overview

Upgrade your digital signal processing capabilities with the SM320LC31PQM40EP by Texas Instruments. Built with high-quality materials and innovative technology, this DSP offers unmatched performance and reliability. Perfect for a wide range of applications, this product provides seamless integration, enhanced efficiency, and improved functionality. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the SM320LC31PQM40EP and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Integrated Cache: YES

The integrated cache improves the DSP's processing speed and efficiency by storing frequently used data for quick access.

Maximum Supply Voltage: 3.47 V

With a high maximum supply voltage, this DSP can handle fluctuations in power supply without risking damage to the internal components.

Address Bus Width: 24

A wider address bus allows the DSP to access a larger memory space, enabling it to handle more complex tasks and data processing.

Bit Size: 32

A 32-bit architecture provides higher precision and accuracy in calculations, making this DSP suitable for applications that require intricate data processing.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common power sources, making this DSP easy to integrate into existing systems.

No. of Terminals: 132

Having a higher number of terminals allows for more connections and interfaces, expanding the DSP's compatibility with various devices and peripherals.

RAM Words: 2048

With a large RAM capacity, this DSP can store and process a significant amount of data simultaneously, increasing its efficiency in handling complex algorithms and tasks.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency enables fast data processing and real-time performance, making this DSP suitable for applications that require quick responses and computations.

Technology: CMOS

CMOS technology offers a good balance between performance, power consumption, and cost-effectiveness, making this DSP a reliable choice for various applications.

Technical Specifications

Digital Signal Processors (DSPs) SM320LC31PQM40EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

19.05 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

132

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP100,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19.05 mm

Peripheral IC Type:

Trade Compliance

SM320LC31PQM40EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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