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SM320F28335KGDS1

Texas Instruments

SM320F28335KGDS1 by Texas Instruments

Texas Instruments SM320F28335KGDS1 is a 32-bit DSP with 150 MHz clock frequency, 250 terminals, and 68 RAM words. Ideal for military applications due to its -55 to 210 °C operating temperature range and boundary scan feature. It offers 8 external interrupts, 13 timers, and low power mode for efficient performance in digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,812 parts In-Stock

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Digiode

USA . 738 parts In-Stock

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738

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Distributors (Availability)

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AZTECH Wire

Italy . 559 parts In-Stock

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$15.548

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559

$15.548

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Corohmni

South Africa . 136 parts In-Stock

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$15.783

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$15.783

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Parana Technologies

USA . 1,506 parts In-Stock

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$17.133

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$17.346

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$17.133

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DigiPath Technology Company

USA . 546 parts In-Stock

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$18.866

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$17.357

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546

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One Stop Electronics

USA . 603 parts In-Stock

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$19.000

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IDEA Electronic Components Group

UK . 1,370 parts In-Stock

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$19.251

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$18.288

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$17.326

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$19.251

$18.288

$17.326

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ChromeModa Solutions

Germany . 398 parts In-Stock

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$19.251

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$15.786

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$15.786

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$59.053

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$53.738

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$48.423

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$59.053

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Component Stockers USA

USA . 574 parts In-Stock

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$99.990

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Microchip USA

USA . 2,344 parts In-Stock

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$485.100

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$472.170

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$465.700

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$459.230

2,344

$485.100

$472.170

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$459.230

Corphita

USA . 724 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SM320F28335KGDS1, a top-of-the-line Digital Signal Processor that delivers unparalleled performance and precision. Manufactured by industry leader Texas Instruments, this DSP is designed to meet the demands of a wide range of applications, from automotive to industrial control systems. With its advanced features and high-quality components, the SM320F28335KGDS1 offers customers exceptional value, efficiency, and reliability. Experience the difference that superior technology can make in your projects with this state-of-the-art DSP from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes the product suitable for compact and densely populated circuit board designs.

Maximum Supply Voltage: 1.995 V

Higher maximum supply voltage allows for greater flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard layout designs and ease of integration.

Bit Size: 32

32-bit architecture allows for efficient processing of complex algorithms and tasks.

No. of Terminals: 250

Higher number of terminals allows for versatile connectivity options and integration with various peripherals.

Package Style (Meter): UNCASED CHIP

Uncased chip package style offers flexibility in mounting options and custom application designs.

Minimum Supply Voltage: 1.805 V

Lower minimum supply voltage helps in reducing power consumption and enhancing energy efficiency.

Maximum Operating Temperature: 210 °C

High maximum operating temperature range ensures reliability and performance in harsh environmental conditions.

CPU Family: C28X

C28X CPU family provides advanced processing capabilities and compatibility with industry-standard software tools.

No. of External Interrupts: 8

Multiple external interrupts enable efficient handling of real-time events and system responsiveness.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature range ensures operation in extreme cold environments and industrial applications.

ADC Channels: YES

Built-in ADC channels support analog input processing for a wide range of sensor and signal processing applications.

Terminal Position: UPPER

Upper terminal position facilitates easy access and connection in circuit board layouts.

RAM Words: 68

Sufficient RAM capacity for data storage and processing requirements of embedded applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during development and production stages.

Maximum Clock Frequency: 150 MHz

High maximum clock frequency enables fast processing speed and real-time data handling capabilities.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency and system performance.

Temperature Grade: MILITARY

Military-grade temperature range ensures ruggedness and reliability in harsh operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports a wide range of digital signal processing tasks and interfacing requirements.

No. of Timers: 13

Multiple timers allow for precise timing control and synchronization in embedded systems and signal processing applications.

RAM Bytes: 69632

Generous RAM capacity in bytes for data storage, caching, and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with modern digital designs.

Terminal Form: NO LEAD

No-lead terminal form factor simplifies the assembly process and improves thermal performance.

Maximum Supply Current: 350 mA

Moderate maximum supply current requirement for efficient power management and thermal design considerations.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage for consistent performance and compatibility with standard power supply configurations.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer and processing without CPU intervention.

PWM Channels: YES

Built-in PWM channels support precise control and modulation of analog signals for motor control and power management applications.

ROM Programmability: OTPROM

One-time programmable ROM offers secure and reliable storage of firmware and configuration settings.

Format: FLOATING POINT

Floating-point format support for high-precision numeric calculations and algorithm implementations.

Low Power Mode: YES

Low power mode enhances energy efficiency and battery life in portable and embedded applications.

On Chip Program ROM Width: 16

16-bit width of on-chip program ROM for efficient storage and execution of program instructions.

Technical Specifications

Digital Signal Processors (DSPs) SM320F28335KGDS1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-XUUC-N250

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

250

No. of Timers:

13

On Chip Program ROM Width:

16

Maximum Operating Temperature:

210 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

69632

RAM Words:

68

ROM Programmability:

OTPROM

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SM320F28335KGDS1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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