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SM320C6748EGWTS3

Texas Instruments

SM320C6748EGWTS3 by Texas Instruments

The Texas Instruments SM320C6748EGWTS3 is a DSP with integrated cache, 23-bit address bus, and 16-bit external data bus. It is used in digital signal processing applications requiring low power consumption and high clock frequency up to 30 MHz. The package style is grid array with 361 terminals, suitable for surface mount assembly.

Median Price

$93.960

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 585 parts In-Stock

1+ parts

$72.690

100+ parts

$70.504

1k+ parts

$54.654

10k+ parts

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585

$72.690

$70.504

$54.654

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DigiKey

USA . 28 parts In-Stock

1+ parts

$115.230

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28

$115.230

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,913 parts In-Stock

1+ parts

$69.056

100+ parts

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3,913

$69.056

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Vyrian

USA . 2,493 parts In-Stock

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2,493

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Distributors (Availability)

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Parana Technologies

USA . 892 parts In-Stock

1+ parts

$56.247

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892

$56.247

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DigiPath Technology Company

USA . 679 parts In-Stock

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$61.935

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679

$61.935

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ChromeModa Solutions

Germany . 1,578 parts In-Stock

1+ parts

$63.199

100+ parts

$51.823

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1,578

$63.199

$51.823

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

1+ parts

$63.199

100+ parts

$60.039

1k+ parts

$56.879

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1,328

$63.199

$60.039

$56.879

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Corphita

USA . 2,741 parts In-Stock

1+ parts

$65.421

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2,741

$65.421

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Corohmni

South Africa . 335 parts In-Stock

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$73.530

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335

$73.530

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Microchip USA

USA . 1,244 parts In-Stock

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$191.981

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1,244

$191.981

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Lixinc

USA . 13,057 parts In-Stock

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13,057

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Overview

Unlock the power of digital signal processing with the SM320C6748EGWTS3 by Texas Instruments. This cutting-edge DSP offers unmatched quality and reliability, thanks to TI's reputation as a leader in semiconductor manufacturing. Ideal for a wide range of applications, this DSP provides seamless integration, low power consumption, and high performance. Elevate your projects with the SM320C6748EGWTS3 and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and ensuring longevity.

Integrated Cache: YES

The integrated cache helps improve processing speed by storing frequently used data and instructions, resulting in enhanced performance.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and enabling efficient assembly.

Maximum Supply Voltage: 1.05 V

Operating within a specified voltage range ensures stable and reliable performance of the DSP.

Address Bus Width: 23

A wider address bus allows for greater memory addressing capabilities, enabling the handling of larger data sets for processing.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and alignment with other components for streamlined design.

No. of Terminals: 361

Having a high number of terminals enables connectivity to various external components and interfaces, expanding the functionality of the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density connectivity with a low profile, making it suitable for compact and advanced designs.

Minimum Supply Voltage: 0.95 V

Operating within a specified voltage range ensures stable and reliable performance of the DSP, even at lower power levels.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the DSP to function in demanding environments without compromising performance.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures ensures the DSP can function reliably in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and conductivity, facilitating easy and reliable connections during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies the installation and connection of the DSP on circuit boards, optimizing space usage and layout.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact overall design and efficient integration within electronic systems.

Width: 16 mm

The moderate width of the DSP facilitates easy installation and integration into various electronic applications.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP, aiding in the development and maintenance of electronic systems.

External Data Bus Width: 16

A wide external data bus allows for efficient data transfer between the DSP and external memory or peripherals, enhancing processing speed.

Maximum Clock Frequency: 30 MHz

A high maximum clock frequency enables fast data processing and execution of instructions, making the DSP suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short time required at peak reflow temperature during assembly helps prevent damage to the DSP and ensures reliable performance.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance of the DSP allows for compatibility with standard reflow soldering processes during assembly.

Internal Bus Architecture: SINGLE

A single internal bus architecture simplifies data handling and communication within the DSP, enhancing operational efficiency.

Length: 16 mm

The compact length of the DSP enables easy integration into space-constrained electronic designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a digital signal processor with various peripheral capabilities, this product offers versatile functionality for a wide range of applications.

No. of Timers: 8

Having multiple timers allows for precise timing and synchronization of operations, enhancing the performance and versatility of the DSP.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and robust performance, making the DSP suitable for energy-efficient and high-performance applications.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation, ensuring reliable operation of the DSP in various environments.

Nominal Supply Voltage: 1 V

Operating within a specified voltage range ensures stable and reliable performance of the DSP, meeting standard power requirements.

No. of DMA Channels: 80

Having a high number of DMA channels allows for efficient data transfer between memory and peripherals, enhancing the DSP's processing capabilities.

Terminal Pitch: 0.8 mm

The close terminal pitch enables high-density packaging and efficient routing of signals, optimizing the overall performance and footprint of the DSP.

Format: FLOATING POINT

Supporting floating-point calculations allows for precise and flexible processing of complex mathematical algorithms, making the DSP suitable for advanced applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the DSP requires careful handling during storage and assembly to prevent damage and ensure optimal performance.

Low Power Mode: YES

The availability of a low-power mode allows for energy-efficient operation and extended battery life in portable electronic devices.

Technical Specifications

Digital Signal Processors (DSPs) SM320C6748EGWTS3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.1V, 1.2V AND 1.3V NOMINAL SUPLY

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

No. of Timers:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

SM320C6748EGWTS3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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