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SM320C30GBM40

Texas Instruments

SM320C30GBM40 by Texas Instruments

Texas Instruments SM320C30GBM40 is a 32-bit DSP with 24-bit address bus, operating at max 40MHz clock frequency. Ideal for military applications due to its ceramic-metal package and low power mode, it features a floating-point format, barrel shifter, and internal multiple bus architecture.

Median Price

$1,803.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14 parts In-Stock

1+ parts

$1,442.810

100+ parts

$1,356.240

1k+ parts

$1,269.670

10k+ parts

-

14

$1,442.810

$1,356.240

$1,269.670

-

DigiKey

USA . 14 parts In-Stock

1+ parts

$1,803.510

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$1,803.510

-

-

-

Verical

USA . 14 parts In-Stock

1+ parts

$1,803.513

100+ parts

$1,695.300

1k+ parts

$1,587.088

10k+ parts

-

14

$1,803.513

$1,695.300

$1,587.088

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,547 parts In-Stock

1+ parts

$1,591.506

100+ parts

-

1k+ parts

-

10k+ parts

-

3,547

$1,591.506

-

-

-

Vyrian

USA . 4,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,421

-

-

-

-

Electronic Expediters

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 797 parts In-Stock

1+ parts

$32.775

100+ parts

-

1k+ parts

$112.511

10k+ parts

-

797

$32.775

-

$112.511

-

DigiPath Technology Company

USA . 1,215 parts In-Stock

1+ parts

$36.089

100+ parts

-

1k+ parts

-

10k+ parts

-

1,215

$36.089

-

-

-

ChromeModa Solutions

Germany . 4,579 parts In-Stock

1+ parts

$36.826

100+ parts

$30.197

1k+ parts

-

10k+ parts

-

4,579

$36.826

$30.197

-

-

IDEA Electronic Components Group

UK . 548 parts In-Stock

1+ parts

$36.826

100+ parts

$34.985

1k+ parts

$33.143

10k+ parts

-

548

$36.826

$34.985

$33.143

-

Corohmni

South Africa . 2,682 parts In-Stock

1+ parts

$47.823

100+ parts

-

1k+ parts

-

10k+ parts

-

2,682

$47.823

-

-

-

Microchip USA

USA . 1,109 parts In-Stock

1+ parts

$797.630

100+ parts

$757.750

1k+ parts

$737.810

10k+ parts

$717.870

1,109

$797.630

$757.750

$737.810

$717.870

Corphita

USA . 2,818 parts In-Stock

1+ parts

$1,507.743

100+ parts

-

1k+ parts

-

10k+ parts

-

2,818

$1,507.743

-

-

-

Overview

Unleash the power of cutting-edge technology with the Texas Instruments SM320C30GBM40 Digital Signal Processor. Crafted with precision and expertise by a renowned manufacturer, this DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this versatile product provides superior value and benefits to customers seeking seamless integration and top-notch efficiency. Elevate your projects to new heights with the SM320C30GBM40 and experience the difference quality makes in your work.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and reliability, ensuring the product can withstand high operating temperatures.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power input range, providing stability and reliability in various power supply conditions.

Address Bus Width: 24

Enables efficient data processing and memory addressing capabilities, enhancing overall performance.

Package Shape: SQUARE

Square shape allows for easy integration and mounting on circuit boards, optimizing space and layout efficiency.

Bit Size: 32

With a larger bit size, the product can handle more complex calculations and algorithms, improving processing capabilities.

Power Supplies (V): 5

Standard power supply voltage ensures compatibility with common power sources and reduces the need for additional components or converters.

No. of Terminals: 181

Higher number of terminals allows for more connectivity options and peripherals to be integrated, increasing versatility and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers improved signal integrity and thermal performance, essential for high-speed and high-frequency applications.

Minimum Supply Voltage: 4.75 V

Provides a safety margin for fluctuations in power supply, ensuring stable operation and protecting the product from voltage spikes.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in harsh environments or under heavy workloads.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures the product can operate in extreme cold conditions without compromising performance or reliability.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easy PCB mounting and soldering, simplifying assembly and maintenance processes.

Maximum Seated Height: 4.7 mm

Low seated height allows for compact form factor design and efficient heat dissipation, ideal for space-constrained applications.

RAM Words: 2048

Large RAM capacity enables the storage and manipulation of extensive data sets, enhancing the product's processing capabilities.

Width: 40.01 mm

Optimal width dimension ensures compatibility with standard PCB layouts and spacing, facilitating easy integration into existing systems.

External Data Bus Width: 32

Matching the bit size, the external data bus width allows for seamless data transfer between the processor and peripherals, reducing bottlenecks.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast data processing and real-time operation, making the product suitable for time-critical applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow efficiency within the processor, optimizing performance and reducing latency.

Length: 40.01 mm

Balanced length dimension ensures uniformity in design and PCB footprint, facilitating easy integration and layout optimization.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and durability in harsh environmental conditions and rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various signal processing applications, making the product suitable for a wide range of uses.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability of the product.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure and reliable connections, ensuring stable signal transmission and preventing connectivity issues.

Maximum Supply Current: 600 mA

Capable of handling higher supply currents, the product can support power-hungry peripherals and operate under demanding conditions.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage simplifies power management and reduces the risk of voltage fluctuations affecting the product's performance.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy connection to external components and peripherals, promoting compatibility and ease of integration.

Format: FLOATING POINT

Floating-point format enhances precision and accuracy in numerical calculations, making the product suitable for demanding computational tasks.

Low Power Mode: YES

Low power mode functionality conserves energy and prolongs battery life, ideal for portable devices or applications requiring power efficiency.

Barrel Shifter: YES

Inclusion of a barrel shifter improves data manipulation and computational efficiency, enhancing the product's processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) SM320C30GBM40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Length:

40.01 mm

Low Power Mode:

YES

No. of Terminals:

181

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181M,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

4.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

40.01 mm

Peripheral IC Type:

Trade Compliance

SM320C30GBM40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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