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PAL20L8ACN

Texas Instruments

PAL20L8ACN by Texas Instruments

PAL20L8ACN by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It offers a propagation delay of 25 ns, making it suitable for applications requiring fast response times. With its combinatorial output function and 64 product terms, this PAL-TYPE device is ideal for commercial use in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,803 parts In-Stock

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Digiode

USA . 162 parts In-Stock

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AZTECH Wire

Italy . 237 parts In-Stock

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$5.651

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$5.651

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One Stop Electronics

USA . 1,197 parts In-Stock

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$22.000

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Parana Technologies

USA . 981 parts In-Stock

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$50.640

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$50.640

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DigiPath Technology Company

USA . 934 parts In-Stock

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$55.761

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$51.300

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934

$55.761

$51.300

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ChromeModa Solutions

Germany . 2,260 parts In-Stock

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$56.899

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$46.657

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2,260

$56.899

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IDEA Electronic Components Group

UK . 1,205 parts In-Stock

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$56.899

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$54.054

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$51.209

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Corphita

USA . 78 parts In-Stock

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Overview

Unlock the power of advanced technology with the PAL20L8ACN from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This Programmable Logic Device is perfect for a wide range of applications, offering customers unmatched value and benefits. With 20 inputs, 8 outputs, and a lightning-fast propagation delay of 25 ns, this device is ideal for creating high-performance electronic systems. Trust Texas Instruments to deliver exceptional products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay: 25 ns

Low propagation delay allows for fast signal processing and efficient performance in time-sensitive applications.

Technology Used: TTL

TTL technology ensures compatibility with existing systems and provides reliable signal processing.

No. of Inputs: 20

Having 20 inputs allows for flexibility in designing complex logic circuits and accommodating multiple input signals.

Package Shape: RECTANGULAR

Rectangular package shape enables easy integration into circuit boards and efficient use of space.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of assembly in PCB designs.

Architecture: PAL-TYPE

PAL-type architecture offers versatility in logic design and customization options for specific applications.

Nominal Supply Voltage (V): 5

Operating at a nominal 5V supply voltage ensures compatibility with standard power sources and ease of integration.

No. of Terminals: 20

Having 20 terminals allows for connecting multiple inputs and outputs efficiently in complex logic circuits.

Programmable IC Type: OT PLD

OT PLD type offers programmability for flexible logic implementation and customization according to specific requirements.

Package Style (Meter): IN-LINE

In-line package style facilitates easy connection and integration in circuit layouts, reducing wiring complexity.

Output Function: COMBINATORIAL

Combinatorial output function allows for various logical operations on input signals, enabling complex logic implementations.

No. of Product Terms: 64

Having 64 product terms provides flexibility in configuring logic equations and accommodating intricate logical functions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the device can withstand moderate thermal conditions and operate reliably in various environments.

Pitch Of Terminal: 2.54 mm

Terminal pitch of 2.54mm offers compatibility with standard PCB layouts and facilitates ease of connection and wiring.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C allows for reliable performance in cold environments and ensures functionality across temperature variations.

Position Of Terminal: DUAL

Dual terminal position provides redundancy and improved connectivity options for input and output connections.

No. of Outputs: 8

Having 8 outputs allows for multiple result options in logic operations and greater flexibility in designing complex logic circuits.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures compatibility with standard operating conditions in commercial applications and reliability in various temperature ranges.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8ACN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T20

Qualified:

No

Trade Compliance

PAL20L8ACN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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