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PAL20L8A-2MJW

Texas Instruments

PAL20L8A-2MJW by Texas Instruments

PAL20L8A-2MJW by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It operates at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. The device comes in a ceramic package with through-hole terminals, ideal for combinatorial logic functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,456 parts In-Stock

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Vyrian

USA . 2,040 parts In-Stock

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2,040

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Distributors (Availability)

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One Stop Electronics

USA . 1,068 parts In-Stock

1+ parts

$15.000

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1,068

$15.000

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AZTECH Wire

Italy . 789 parts In-Stock

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$19.218

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789

$19.218

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Parana Technologies

USA . 223 parts In-Stock

1+ parts

$86.827

100+ parts

$8,063.169

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$78.144

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223

$86.827

$8,063.169

$78.144

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DigiPath Technology Company

USA . 134 parts In-Stock

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$95.607

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$87.958

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134

$95.607

$87.958

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ChromeModa Solutions

Germany . 2,222 parts In-Stock

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$97.558

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$79.998

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$97.558

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

1+ parts

$97.558

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$92.680

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$87.802

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2,070

$97.558

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$87.802

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Corphita

USA . 3,711 parts In-Stock

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Overview

Unlock the power of innovation with the PAL20L8A-2MJW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Programmable Logic Devices that offer unmatched reliability and performance. Ideal for a wide range of applications, this PAL20L8A-2MJW is designed to provide customers with valuable solutions that streamline processes and enhance efficiency. Experience the benefits of cutting-edge technology and trust in the excellence that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal and mechanical properties, making the device reliable and durable in various operating conditions.

Technology Used: TTL

TTL technology offers high speed and reliability, ensuring efficient operation of the PLD.

No. of Inputs: 20

Having a high number of inputs allows for complex logic functions to be implemented, making the PLD versatile in applications.

Architecture: PAL-TYPE

PAL-type architecture provides programmable logic that can be customized to suit specific design requirements, offering flexibility and versatility.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V makes the PLD compatible with standard electronic systems and ensures easy integration.

No. of Outputs: 8

Having multiple outputs allows for the generation of diverse output signals, enhancing the functionality of the PLD.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures that the PLD can operate reliably in extreme temperature conditions, making it suitable for demanding environments.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8A-2MJW attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.6

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T24

Qualified:

No

Trade Compliance

PAL20L8A-2MJW Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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