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PAL20L8AMJWB

Texas Instruments

PAL20L8AMJWB by Texas Instruments

PAL20L8AMJWB by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It offers a propagation delay of 30 ns, operates at temperatures ranging from -55°C to 125°C, and is MILITARY graded. This programmable IC in RECTANGULAR package shape is ideal for COMBINATORIAL applications requiring high-speed logic operations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,284 parts In-Stock

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7,284

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Digiode

USA . 3,664 parts In-Stock

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3,664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$15.620

100+ parts

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890

$15.620

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Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

$17.046

100+ parts

$1,582.995

1k+ parts

$15.342

10k+ parts

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1,744

$17.046

$1,582.995

$15.342

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DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$18.770

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1,780

$18.770

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ChromeModa Solutions

Germany . 1,270 parts In-Stock

1+ parts

$19.153

100+ parts

$15.705

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1,270

$19.153

$15.705

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IDEA Electronic Components Group

UK . 562 parts In-Stock

1+ parts

$19.153

100+ parts

$18.195

1k+ parts

$17.238

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562

$19.153

$18.195

$17.238

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One Stop Electronics

USA . 1,372 parts In-Stock

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$20.000

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1,372

$20.000

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Corphita

USA . 645 parts In-Stock

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645

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Overview

Unlock limitless possibilities with the PAL20L8AMJWB by Texas Instruments, a top-tier manufacturer known for exceptional quality. As a Programmable Logic Device, this product offers unparalleled flexibility and reliability in various applications. Experience lightning-fast performance with a propagation delay of just 30 ns, making it ideal for time-sensitive projects. With a MILITARY grading of temperature and a Nominal Supply Voltage of 5V, this PLD ensures seamless operation even in extreme conditions. Elevate your designs with the PAL20L8AMJWB and see your projects come to life with ease and precision.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and mechanical strength, ensuring reliable operation and durability.

Propagation Delay: 30 ns

Low propagation delay ensures fast signal processing and response times, making it suitable for high-speed applications.

Screening Level: 38535Q/M;38534H;883B

High screening level ensures quality and reliability, meeting stringent military standards.

Technology Used: TTL

TTL technology offers low power consumption and compatibility with existing TTL-based systems.

No. of Inputs: 20

High number of inputs allow for complex logic functions and versatile programming options.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration and space-saving design in electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of assembly in PCBs.

Architecture: PAL-TYPE

PAL-type architecture enables efficient programming and customization of logic functions.

Nominal Supply Voltage (V): 5

Compatibility with standard 5V supply voltage simplifies integration with existing systems.

Power Supplies (V): 5

Consistent 5V power supplies ensure stable operation and reliable performance.

No. of Terminals: 24

Sufficient number of terminals for input, output, and power connections, allowing for versatile applications.

Programmable IC Type: OT PLD

OT PLD type offers programmability and flexibility for custom logic functions and configurations.

Package Style (Meter): IN-LINE

In-line package style facilitates easy mounting and compact layout in electronic circuits.

Output Function: COMBINATORIAL

Combinatorial output function allows for complex logic operations and efficient signal processing.

No. of Product Terms: 64

High number of product terms enable complex logic expressions and versatile programming options.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125°C ensures reliable performance in varying environmental conditions.

Pitch Of Terminal: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy PCB layout and compatibility with common connectors.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C ensures reliable performance even in harsh environments.

Position Of Terminal: DUAL

Dual terminal positioning offers flexibility in PCB layout and ease of connections.

No. of Outputs: 8

Multiple output channels provide versatility in logic functions and signal processing capabilities.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures durability and reliability in extreme operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8AMJWB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.6

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T24

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL20L8AMJWB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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