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PAL20L8A-2MJWB

Texas Instruments

PAL20L8A-2MJWB by Texas Instruments

PAL20L8A-2MJWB by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It operates at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. With a package style of IN-LINE and through-hole terminals, this device is ideal for combinatorial logic functions in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,078 parts In-Stock

1+ parts

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7,078

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Digiode

USA . 3,162 parts In-Stock

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3,162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$15.252

100+ parts

-

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682

$15.252

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One Stop Electronics

USA . 736 parts In-Stock

1+ parts

$16.000

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736

$16.000

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Parana Technologies

USA . 1,005 parts In-Stock

1+ parts

$138.708

100+ parts

$12,881.168

1k+ parts

$124.837

10k+ parts

-

1,005

$138.708

$12,881.168

$124.837

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DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$152.735

100+ parts

$140.516

1k+ parts

-

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820

$152.735

$140.516

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ChromeModa Solutions

Germany . 4,987 parts In-Stock

1+ parts

$155.852

100+ parts

$127.799

1k+ parts

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4,987

$155.852

$127.799

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IDEA Electronic Components Group

UK . 543 parts In-Stock

1+ parts

$155.852

100+ parts

$148.059

1k+ parts

$140.267

10k+ parts

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543

$155.852

$148.059

$140.267

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Corphita

USA . 1,720 parts In-Stock

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1,720

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Overview

Enhance your electronic projects with the PAL20L8A-2MJWB by Texas Instruments, a high-quality Programmable Logic Device that offers unmatched versatility and reliability. Manufactured by the trusted brand Texas Instruments, this PLD is designed to meet the demands of various applications with its advanced technology and superior performance. Whether you're working on industrial automation, telecommunications, or consumer electronics, this device provides value and benefits like no other. Upgrade your designs today with the PAL20L8A-2MJWB and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic offers excellent thermal properties, making it suitable for high temperature environments and ensuring reliability and durability of the product.

Technology Used: TTL

TTL technology provides fast switching speeds and low power consumption, making the PLD efficient and responsive in various applications.

Nominal Supply Voltage (V): 5

Operating at a standard supply voltage of 5V makes the PLD compatible with common power sources, simplifying integration and reducing compatibility issues.

Output Function: COMBINATORIAL

Combinatorial output function allows for complex logic operations to be implemented, providing flexibility and versatility in designing circuits with the PLD.

No. of Product Terms: 64

Having a high number of product terms enables the PLD to handle more complex logic functions and tasks, making it suitable for advanced applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the PLD is capable of withstanding harsh environmental conditions, ensuring reliability and longevity in extreme settings.

No. of Outputs: 8

Offering 8 outputs allows for multiple signals to be generated simultaneously, enhancing the functionality and performance of the PLD in multi-output applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8A-2MJWB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.6

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T24

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL20L8A-2MJWB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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