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PAL20L8A-2CJW

Texas Instruments

PAL20L8A-2CJW by Texas Instruments

PAL20L8A-2CJW by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It operates at a nominal voltage of 5V, suitable for commercial applications requiring combinatorial output functions. Housed in a ceramic package with through-hole terminals, it offers reliable performance in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,357 parts In-Stock

1+ parts

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6,357

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Digiode

USA . 999 parts In-Stock

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999

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,497 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,497

$8.000

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AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$12.797

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483

$12.797

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Parana Technologies

USA . 939 parts In-Stock

1+ parts

$151.427

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939

$151.427

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DigiPath Technology Company

USA . 2,090 parts In-Stock

1+ parts

$166.740

100+ parts

$153.401

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2,090

$166.740

$153.401

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ChromeModa Solutions

Germany . 1,754 parts In-Stock

1+ parts

$170.143

100+ parts

$139.517

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1,754

$170.143

$139.517

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IDEA Electronic Components Group

UK . 291 parts In-Stock

1+ parts

$170.143

100+ parts

$161.636

1k+ parts

$153.129

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291

$170.143

$161.636

$153.129

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Corphita

USA . 4,642 parts In-Stock

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4,642

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Overview

Unlock endless possibilities with the PAL20L8A-2CJW by Texas Instruments, a top-tier manufacturer known for its quality and reliability. As a Programmable Logic Device (PLD), this innovative product offers unparalleled flexibility and customization in various applications. Whether you're designing complex digital circuits or optimizing system performance, the PAL20L8A-2CJW provides the value, benefits, and advantages you need to stay ahead of the competition. Trust Texas Instruments to deliver cutting-edge technology that meets your demands and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer high thermal conductivity and mechanical strength, ensuring reliable performance and durability.

Technology Used: TTL

TTL technology provides fast switching speeds and compatibility with a wide range of other digital components.

No. of Inputs: 20

Having 20 inputs allows for versatile connectivity and complex logic operations within the PLD.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and easy to integrate into electronic circuits or systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering during assembly.

Architecture: PAL-TYPE

PAL-type architecture offers flexible programmability and efficient combinational logic capabilities.

Nominal Supply Voltage (V): 5

Operating at a nominal voltage of 5V allows for compatibility with standard digital logic systems and power sources.

Output Function: COMBINATORIAL

Combinatorial output function enables the PLD to perform logic operations without storing intermediate results, improving efficiency.

No. of Product Terms: 64

Having 64 product terms allows for complex Boolean logic expressions to be implemented within the PLD.

No. of Outputs: 8

Having 8 outputs provides ample flexibility for routing logic results to various components or subsystems.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8A-2CJW attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.6

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T24

Qualified:

No

Trade Compliance

PAL20L8A-2CJW Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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