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PAL20L8AMFK

Texas Instruments

PAL20L8AMFK by Texas Instruments

PAL20L8AMFK by Texas Instruments is a TTL technology-based PLD with 30 ns propagation delay. It features 20 inputs, 8 outputs, and 6 I/O lines in a square chip carrier package. Ideal for military applications requiring fast combinatorial output functions within a temperature range of -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,146 parts In-Stock

1+ parts

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8,146

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Digiode

USA . 4,006 parts In-Stock

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4,006

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,194 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,194

$8.000

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$11.007

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766

$11.007

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Parana Technologies

USA . 1,007 parts In-Stock

1+ parts

$25.296

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-

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$25.924

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1,007

$25.296

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$25.924

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DigiPath Technology Company

USA . 1,654 parts In-Stock

1+ parts

$27.854

100+ parts

$25.625

1k+ parts

-

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1,654

$27.854

$25.625

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ChromeModa Solutions

Germany . 5,367 parts In-Stock

1+ parts

$28.422

100+ parts

$23.306

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5,367

$28.422

$23.306

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

1+ parts

$28.422

100+ parts

$27.001

1k+ parts

$25.580

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2,070

$28.422

$27.001

$25.580

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Corphita

USA . 1,111 parts In-Stock

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Overview

Enhance the efficiency and performance of your electronic projects with the PAL20L8AMFK by Texas Instruments. Crafted with high-quality materials and cutting-edge technology, this Programmable Logic Device is designed to meet the demands of various applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile PLD offers unmatched value and benefits. With its reliable construction and fast propagation delay, the PAL20L8AMFK provides an edge in circuit design, making it a top choice for engineers seeking superior results. Experience the advantages of precision engineering and innovation with Texas Instruments' PAL20L8AMFK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability of the product, making it suitable for long-term use in various environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

No. of Inputs: 20

With a high number of inputs, this PLD can handle complex logic operations effectively, making it ideal for intricate circuit designs.

Technology Used: TTL

TTL technology offers fast switching speeds and low power consumption, enhancing the overall performance and efficiency of the device.

No. of Outputs: 8

Having multiple outputs enables the PLD to drive multiple components or subsystems, increasing its versatility and applicability in diverse systems.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8AMFK attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

No. of Dedicated Inputs:

14

No. of I/O Lines:

6

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Width:

11.43 mm

Length:

11.43 mm

Maximum Seated Height:

2.03 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-N28

Qualified:

No

Trade Compliance

PAL20L8AMFK Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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