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PAL20L8AJM/883C

Texas Instruments

PAL20L8AJM/883C by Texas Instruments

PAL20L8AJM/883C by Texas Instruments is a MIL-STD-883 Class C rated PLD with 30ns propagation delay. Featuring TTL technology, it has 20 inputs and 8 outputs, making it ideal for combinatorial applications. With a temperature range of -55 to 125°C, this device is suitable for military-grade projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,276 parts In-Stock

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Anansix

USA . 2,529 parts In-Stock

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Digiode

USA . 1,306 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 794 parts In-Stock

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$17.909

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794

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One Stop Electronics

USA . 225 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,721 parts In-Stock

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$82.735

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$7,683.227

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$74.462

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1,721

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DigiPath Technology Company

USA . 2,261 parts In-Stock

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$91.102

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ChromeModa Solutions

Germany . 6,602 parts In-Stock

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$92.961

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$76.228

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IDEA Electronic Components Group

UK . 1,249 parts In-Stock

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$92.961

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$88.313

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$83.665

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Corphita

USA . 4,180 parts In-Stock

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Overview

Upgrade your electronic projects with the PAL20L8AJM/883C by Texas Instruments, a high-quality Programmable Logic Device that offers fast propagation delay and reliable performance. Manufactured by a trusted industry leader, this PAL device is perfect for a wide range of applications in military-grade electronics. With 20 inputs, 8 outputs, and 64 product terms, this versatile PLD delivers exceptional value and flexibility to bring your designs to life. Trust Texas Instruments for top-tier technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and reliability, making it suitable for military-grade applications.

Propagation Delay: 30 ns

Fast propagation delay ensures quick response time for signal processing, making it ideal for high-speed applications.

Surface Mount: THRU-HOLE

Thru-hole mounting offers strong mechanical connections, making the device suitable for harsh environments.

Screening Level: MIL-STD-883 Class C

Meeting MIL-STD-883 Class C standards ensures high reliability and compliance with military-grade requirements.

Technology Used: TTL

TTL technology provides high noise immunity and compatibility with various devices, ensuring reliable operation in complex systems.

No. of Inputs: 20

Having 20 inputs allows for complex logic operations, making the device versatile for a wide range of applications.

Nominal Supply Voltage (V): 5

Operating at 5V nominal supply voltage is common and compatible with many existing systems, simplifying integration.

Output Function: COMBINATORIAL

Combinatorial output function allows for versatile logic operations, enabling the device to perform a wide range of functions.

No. of Product Terms: 64

Having 64 product terms provides flexibility in designing complex logic functions, making the device suitable for advanced applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C ensures reliable performance even in high-temperature environments, making it suitable for demanding applications.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55°C allows the device to function in extreme cold conditions, enhancing its versatility.

Finishing Of Terminal Used: Tin/Lead (Sn/Pb)

Using tin/lead finishing on terminals provides good solderability and robust electrical connections, ensuring reliability in operation.

No. of Outputs: 8

Having 8 outputs allows for multiple signal paths, increasing the device's functionality and usefulness in complex systems.

Grading Of Temperature: MILITARY

Meeting military-grade temperature standards ensures the device's reliability and performance in harsh environments, making it suitable for defense applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8AJM/883C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-XDIP-T24

JESD-609 Code:

e0

Qualified:

No

Screening Level:

MIL-STD-883 Class C

Trade Compliance

PAL20L8AJM/883C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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