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PAL20L8AMJW

Texas Instruments

PAL20L8AMJW by Texas Instruments

PAL20L8AMJW by Texas Instruments is a TTL technology-based PLD with 30 ns propagation delay and 5.5 V max supply voltage. It features 20 inputs, 8 outputs, and 6 I/O lines in a rectangular ceramic package. Ideal for military applications requiring combinatorial output functions with a temperature range of -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,611 parts In-Stock

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Digiode

USA . 1,481 parts In-Stock

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1,481

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Distributors (Availability)

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AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$5.540

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308

$5.540

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One Stop Electronics

USA . 241 parts In-Stock

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$28.000

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241

$28.000

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Parana Technologies

USA . 853 parts In-Stock

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$49.199

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853

$49.199

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DigiPath Technology Company

USA . 827 parts In-Stock

1+ parts

$54.174

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$49.840

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827

$54.174

$49.840

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IDEA Electronic Components Group

UK . 1,516 parts In-Stock

1+ parts

$55.280

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$52.516

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$49.752

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1,516

$55.280

$52.516

$49.752

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ChromeModa Solutions

Germany . 1,473 parts In-Stock

1+ parts

$55.280

100+ parts

$45.330

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$55.280

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Corphita

USA . 1,001 parts In-Stock

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Overview

Elevate your electronic projects with the Texas Instruments PAL20L8AMJW Programmable Logic Device. Crafted with precision and expertise by a trusted manufacturer, this PLD offers unparalleled performance and reliability. Ideal for a variety of applications in industries like aerospace, defense, and telecommunications, this versatile device provides speed and efficiency in your designs. With quick propagation delay and high-quality materials, the PAL20L8AMJW ensures seamless operation and optimal functionality. Upgrade your projects today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection to the internal components, ensuring reliability in various environmental conditions.

Propagation Delay: 30 ns

Fast propagation delay allows for quick signal processing, making this product suitable for time-critical applications.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power requirements for different applications.

Technology Used: TTL

TTL technology offers high-speed signal processing and compatibility with other TTL devices, enhancing overall system performance.

No. of Inputs: 20

With a high number of inputs, this PLD can handle complex logic functions, making it suitable for advanced applications.

Output Function: COMBINATORIAL

Combinatorial output function allows for flexible logic configurations, enabling versatile circuit designs.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliable operation in harsh environments, making this PLD ideal for rugged applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8AMJW attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

No. of Dedicated Inputs:

14

No. of I/O Lines:

6

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.6

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

PAL20L8AMJW Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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