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PAL20L8A-2MFKB

Texas Instruments

PAL20L8A-2MFKB by Texas Instruments

PAL20L8A-2MFKB by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It operates at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. This chip carrier package features a combinatorial output function and 64 product terms, ideal for PAL-type architecture designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,711 parts In-Stock

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Digiode

USA . 3,691 parts In-Stock

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3,691

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Distributors (Availability)

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One Stop Electronics

USA . 386 parts In-Stock

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$18.000

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386

$18.000

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AZTECH Wire

Italy . 665 parts In-Stock

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$19.318

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665

$19.318

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Parana Technologies

USA . 1,128 parts In-Stock

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$52.141

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$52.141

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DigiPath Technology Company

USA . 1,709 parts In-Stock

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$57.413

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$52.820

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1,709

$57.413

$52.820

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ChromeModa Solutions

Germany . 5,678 parts In-Stock

1+ parts

$58.585

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$48.040

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5,678

$58.585

$48.040

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IDEA Electronic Components Group

UK . 1,840 parts In-Stock

1+ parts

$58.585

100+ parts

$55.656

1k+ parts

$52.726

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1,840

$58.585

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$52.726

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Corphita

USA . 4,600 parts In-Stock

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Overview

Elevate your projects with the PAL20L8A-2MFKB by Texas Instruments, a top-tier Programmable Logic Device designed for high-performance applications. Crafted with precision and expertise by renowned manufacturer Texas Instruments, this PLD offers unrivaled quality and reliability. With its advanced technology and innovative design, this device is ideal for a wide range of applications. Experience the value and benefits of seamless integration, efficient functionality, and superior performance that the PAL20L8A-2MFKB brings to the table. Upgrade your projects with confidence and precision with this exceptional product.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer high durability and thermal conductivity, making this product suitable for rugged environments and high temperature applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on printed circuit boards, saving space and reducing assembly costs.

Screening Level: 38535Q/M;38534H;883B

This screening level ensures high reliability and quality, making this product ideal for mission-critical and high-end applications.

Technology Used: TTL

TTL technology provides fast switching speeds and low power consumption, offering efficient performance for a wide range of applications.

Nominal Supply Voltage (V): 5

Operating at a standard supply voltage of 5V, this product is compatible with a wide range of systems and components.

Output Function: COMBINATORIAL

Combinatorial output function allows for complex logic operations to be implemented, offering flexibility and versatility in design.

Pitch Of Terminal: 1.27 mm

The small pitch of terminals enables high-density mounting and interconnection, maximizing board space utilization and miniaturization.

No. of Outputs: 8

With 8 output capabilities, this product can drive multiple peripherals or components simultaneously, enhancing overall system performance.

Grading Of Temperature: MILITARY

Designed to operate in extreme temperature environments, this product meets stringent military standards for performance and reliability.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8A-2MFKB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-XQCC-N28

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL20L8A-2MFKB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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