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PAL20L8A-2MFH

Texas Instruments

PAL20L8A-2MFH by Texas Instruments

PAL20L8A-2MFH by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It operates at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. Housed in a ceramic chip carrier package, this PAL-type device offers combinatorial output functions for various digital logic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,223 parts In-Stock

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Digiode

USA . 547 parts In-Stock

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547

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AZTECH Wire

Italy . 776 parts In-Stock

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$11.162

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One Stop Electronics

USA . 584 parts In-Stock

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$22.000

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Parana Technologies

USA . 1,430 parts In-Stock

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$114.852

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DigiPath Technology Company

USA . 695 parts In-Stock

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$126.466

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$116.349

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695

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IDEA Electronic Components Group

UK . 2,064 parts In-Stock

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$129.047

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$122.595

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$116.142

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2,064

$129.047

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$116.142

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ChromeModa Solutions

Germany . 285 parts In-Stock

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$129.047

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$105.819

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Corphita

USA . 3,297 parts In-Stock

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Overview

Unlock endless possibilities with the PAL20L8A-2MFH by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments sets the bar high for quality and innovation. This programmable logic device offers a wide range of applications in various industries, providing customers with flexibility and efficiency. With its advanced technology and reliable performance, the PAL20L8A-2MFH guarantees seamless operation and optimal results. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal and mechanical properties, making the device durable and resistant to temperature fluctuations.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and reducing assembly time.

Technology Used: TTL

Transistor-transistor logic technology ensures high-speed performance and compatibility with existing TTL circuits.

No. of Inputs: 20

With 20 input channels, this PLD can handle complex logic functions and accommodate multiple input signals.

Package Shape: SQUARE

Square package shape provides efficient use of space on the circuit board and easy alignment during assembly.

Form Of Terminal: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations for hazardous substance limitations.

Architecture: PAL-TYPE

Programmable Array Logic (PAL) architecture offers flexibility in designing custom logic functions and easy reprogramming capabilities.

Nominal Supply Voltage (V): 5

Operating at a 5V supply voltage ensures compatibility with standard TTL logic levels and power requirements.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable performance and stability of the PLD.

No. of Terminals: 28

With 28 terminals, this PLD provides ample connectivity options for inputs, outputs, and power supplies.

Programmable IC Type: OT PLD

This PLD falls under the category of Output Terminal Programmable Logic Devices, offering versatile output configuration options.

Package Style (Meter): CHIP CARRIER

Chip carrier package style facilitates reliable connection to the circuit board and compact design for space-constrained applications.

Output Function: COMBINATORIAL

Combinatorial output function allows for flexible logic operations and efficient implementation of complex Boolean functions.

No. of Product Terms: 64

With 64 product terms, this PLD can support a wide range of logic operations and accommodate complex logic functions.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C ensures reliable performance in high-temperature environments.

Pitch Of Terminal: 1.27 mm

With a terminal pitch of 1.27mm, this PLD offers easy integration and compatibility with standard PCB layouts.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55°C ensures reliable performance in low-temperature environments.

Position Of Terminal: QUAD

Quad position of terminals offers efficient routing and connection options on the circuit board, enhancing ease of installation.

No. of Outputs: 8

With 8 output channels, this PLD can drive multiple external devices and accommodate complex output configurations.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures robust performance and reliability in harsh environmental conditions and mission-critical applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8A-2MFH attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-XQCC-N28

Qualified:

No

Trade Compliance

PAL20L8A-2MFH Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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