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PAL20L8AMFH

Texas Instruments

PAL20L8AMFH by Texas Instruments

PAL20L8AMFH by Texas Instruments is a TTL technology-based PLD with 30 ns propagation delay. It features 20 inputs, 8 outputs, and operates at supply voltages b/w 4.5V to 5.5V. Ideal for military applications due to its MILITARY grading and ceramic package body material with metal-sealed cofired technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,203 parts In-Stock

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Digiode

USA . 663 parts In-Stock

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663

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Distributors (Availability)

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AZTECH Wire

Italy . 875 parts In-Stock

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$11.495

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875

$11.495

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One Stop Electronics

USA . 643 parts In-Stock

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$16.000

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643

$16.000

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Parana Technologies

USA . 1,662 parts In-Stock

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$104.894

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$104.894

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DigiPath Technology Company

USA . 1,139 parts In-Stock

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$115.501

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$106.261

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1,139

$115.501

$106.261

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ChromeModa Solutions

Germany . 4,778 parts In-Stock

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$117.858

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$96.644

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$117.858

$96.644

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IDEA Electronic Components Group

UK . 47 parts In-Stock

1+ parts

$117.858

100+ parts

$111.965

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$106.072

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47

$117.858

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$106.072

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Corphita

USA . 4,184 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PAL20L8AMFH by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device (PLD) offers unparalleled performance in a wide range of applications. With lightning-fast propagation delay and versatile architecture, this PAL-type IC delivers exceptional results for your projects. Experience seamless integration and top-notch reliability with Texas Instruments' state-of-the-art technology. Elevate your designs and streamline your processes with the PAL20L8AMFH today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Propagation Delay: 30 ns

The low propagation delay ensures fast signal processing, making the product efficient for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, enhancing the product's usability.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can support a wide range of applications without risking damage due to overvoltage.

Technology Used: TTL

The TTL technology ensures compatibility with a variety of other digital components, making integration seamless and hassle-free.

No. of Inputs: 20

Having a high number of inputs allows for versatile input configurations, enabling the product to accommodate complex logic operations.

Package Shape: SQUARE

The square package shape provides efficient use of space on a circuit board, optimizing layout and design considerations.

Form Of Terminal: J BEND

The J-bend terminals facilitate easy soldering and secure connections, ensuring reliable performance in the long run.

Architecture: PAL-TYPE

The PAL-type architecture offers programmability and flexibility, allowing for customization to suit specific application requirements.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Power Supplies (V): 5

Having a consistent power supply voltage of 5V ensures stable and reliable operation of the product under normal operating conditions.

No. of Terminals: 28

The high number of terminals allows for multiple connections and configurations, providing versatility and adaptability for various applications.

Programmable IC Type: OT PLD

The OT PLD type enables programmability and customization, making the product suitable for diverse logic applications that require flexibility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and space-saving benefits, ideal for applications where size constraints are important.

Output Function: COMBINATORIAL

The combinatorial output function allows for complex logical operations and processing, making the product versatile and capable of handling various tasks.

No. of Product Terms: 64

With 64 product terms, the product can execute a wide range of logic functions, providing flexibility and versatility in logic operations.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures the product can operate within specified voltage ranges, enhancing its reliability and performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for demanding environments and ensures reliable performance under varying temperature conditions.

Pitch Of Terminal: 1.27 mm

The specific terminal pitch of 1.27mm allows for precise connections and soldering, ensuring reliable electrical contact and signal transmission.

Organization: 14 DEDICATED INPUTS, 6 I/O

The organization with dedicated inputs and I/O lines provides structured and efficient connectivity options, improving the product's overall performance and functionality.

No. of Dedicated Inputs: 14

Having 14 dedicated inputs allows for specific signals to be processed independently, enhancing the product's versatility and performance capabilities.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable operation in cold environments, making the product suitable for a wide range of temperature conditions.

Position Of Terminal: QUAD

The quad terminal position provides efficient space utilization and easy connectivity, enhancing the product's usability and functionality in various applications.

Maximum Seated Height: 2.54 mm

The low maximum seated height allows for compact and space-efficient installation on circuit boards, ideal for applications with limited vertical clearance.

Width: 11.43 mm

The specific width dimension of 11.43mm ensures compatibility with standard board layouts and spacing requirements, making integration seamless.

No. of Outputs: 8

Having 8 outputs enables the product to drive multiple devices or signals simultaneously, enhancing its functionality and utility in various applications.

Length: 11.43 mm

The specific length dimension of 11.43mm ensures compatibility with standard board layouts and spacing requirements, facilitating easy integration and installation.

No. of I/O Lines: 6

With 6 I/O lines, the product can interface with external devices and systems, enabling data exchange and communication for a wide range of applications.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures that the product can operate reliably in extreme temperature conditions, making it suitable for rugged and demanding applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8AMFH attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

No. of Dedicated Inputs:

14

No. of I/O Lines:

6

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Width:

11.43 mm

Length:

11.43 mm

Maximum Seated Height:

2.54 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-J28

Qualified:

No

Trade Compliance

PAL20L8AMFH Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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