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PAL20L8A-2CFN

Texas Instruments

PAL20L8A-2CFN by Texas Instruments

PAL20L8A-2CFN by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It operates at a nominal voltage of 5V, has 64 product terms, and offers combinatorial output function. This programmable IC in chip carrier package is ideal for commercial applications requiring PAL-type architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,169 parts In-Stock

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8,169

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Digiode

USA . 1,075 parts In-Stock

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1,075

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 509 parts In-Stock

1+ parts

$7.000

100+ parts

-

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509

$7.000

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AZTECH Wire

Italy . 354 parts In-Stock

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$14.546

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354

$14.546

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Parana Technologies

USA . 933 parts In-Stock

1+ parts

$130.480

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933

$130.480

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DigiPath Technology Company

USA . 1,740 parts In-Stock

1+ parts

$143.675

100+ parts

$132.181

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1,740

$143.675

$132.181

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ChromeModa Solutions

Germany . 3,477 parts In-Stock

1+ parts

$146.607

100+ parts

$120.218

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3,477

$146.607

$120.218

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IDEA Electronic Components Group

UK . 2,353 parts In-Stock

1+ parts

$146.607

100+ parts

$139.277

1k+ parts

$131.946

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2,353

$146.607

$139.277

$131.946

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Corphita

USA . 1,662 parts In-Stock

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1,662

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Overview

Unlock the power of innovation with the PAL20L8A-2CFN programmable logic device by Texas Instruments. Crafted with precision and expertise, this PLD offers unparalleled quality and reliability for a variety of applications. From enhancing industrial automation to optimizing communication systems, this versatile device delivers exceptional performance and efficiency. Experience seamless integration, faster processing, and superior functionality with the PAL20L8A-2CFN. Elevate your projects to new heights with Texas Instruments' cutting-edge technology and unleash endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Technology Used: TTL

TTL technology provides fast switching speeds and low power consumption, making the PLD efficient in terms of performance and energy usage.

No. of Inputs: 20

With 20 inputs, the PLD can handle a wide range of input signals, enhancing flexibility in design and functionality.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit layouts, optimizing space utilization on the PCB.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to incorporate into existing systems.

Output Function: COMBINATORIAL

The combinatorial output function allows for flexible logic operations, enabling the PLD to perform a variety of tasks efficiently.

No. of Outputs: 8

With 8 outputs, the PLD can drive multiple devices or subsystems, enhancing the versatility and scalability of the product.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8A-2CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

PAL20L8A-2CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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