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PAL20L8AMFKB

Texas Instruments

PAL20L8AMFKB by Texas Instruments

PAL20L8AMFKB by Texas Instruments is a TTL technology-based PLD with 20 inputs and 8 outputs. It offers a propagation delay of 30 ns, operates at temperatures ranging from -55°C to 125°C, and is MILITARY graded. This programmable IC in CHIP CARRIER package shape is ideal for COMBINATORIAL output functions in military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,557 parts In-Stock

1+ parts

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4,557

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Digiode

USA . 2,711 parts In-Stock

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2,711

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$10.254

100+ parts

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525

$10.254

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Parana Technologies

USA . 115 parts In-Stock

1+ parts

$22.574

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-

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$23.233

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115

$22.574

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$23.233

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DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$24.857

100+ parts

$22.868

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1,646

$24.857

$22.868

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ChromeModa Solutions

Germany . 3,582 parts In-Stock

1+ parts

$25.364

100+ parts

$20.798

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3,582

$25.364

$20.798

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IDEA Electronic Components Group

UK . 1,338 parts In-Stock

1+ parts

$25.364

100+ parts

$24.096

1k+ parts

$22.828

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1,338

$25.364

$24.096

$22.828

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One Stop Electronics

USA . 371 parts In-Stock

1+ parts

$30.000

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371

$30.000

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Corphita

USA . 1,158 parts In-Stock

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1,158

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Overview

Elevate your projects with the PAL20L8AMFKB by Texas Instruments, a top-of-the-line Programmable Logic Device designed for ultimate performance and reliability. Crafted by the renowned manufacturer, Texas Instruments, this PLD offers unmatched quality and precision in every application. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile chip is sure to exceed your expectations. Say goodbye to limitations and hello to endless possibilities with the PAL20L8AMFKB - the perfect solution for all your programmable IC needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides high durability and excellent thermal conductivity, ensuring reliable performance in harsh environments.

Propagation Delay: 30 ns

With a fast propagation delay of 30 ns, this PLD offers quick response times for efficient processing of signals.

Surface Mount: YES

Surface mount compatibility allows for easy installation on PCBs, saving space and facilitating automated assembly processes.

Technology Used: TTL

TTL technology ensures compatibility with a wide range of systems and seamless integration into existing setups.

No. of Inputs: 20

Having 20 inputs enables versatile and complex logic operations to be implemented, catering to diverse application requirements.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V offers standard power requirements, making it compatible with common power sources.

Architecture: PAL-TYPE

PAL-type architecture provides programmable AND/OR logic functions, offering flexibility in designing custom logic circuits.

Output Function: COMBINATORIAL

Combinatorial output function allows for the creation of complex logic functions based on input conditions, enhancing the versatility of the device.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this PLD can withstand elevated temperatures without performance degradation, suitable for rugged environments.

Minimum Operating Temperature: -55 °C

Operating down to -55°C ensures reliable functionality in extreme cold conditions, making it suitable for a wide range of operating environments.

No. of Outputs: 8

The 8 outputs offer multiple logic signal routing options, allowing for the generation of varied output patterns in response to input conditions.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures robust performance and reliability under demanding conditions, making it suitable for mission-critical applications.

Technical Specifications

Programmable Logic Devices (PLD) PAL20L8AMFKB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

20

No. of Product Terms:

64

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-XQCC-N28

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

PAL20L8AMFKB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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