Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XA2C64A-8VQG44Q by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, suitable for automotive applications. Operating at -40 to 125 °C, it features in-system programmability and JTAG boundary scan test capability. With a compact form factor of 10x10 mm and low power supplies of 1.5/3.3 V, it offers high performance in a small footprint for various electronic systems.
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This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.
Low propagation delay ensures fast response times, making the product ideal for applications where timing is critical.
Surface mount technology saves space and allows for easy integration into compact designs.
Operates within a safe voltage range, ensuring stability and reliable performance.
The large number of macro cells provides flexibility for complex programmable logic configurations.
Compliance with automotive standards ensures the product is suitable for use in automotive applications.
CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.
Square package shape allows for efficient use of space and easy placement on circuit boards.
Gull wing terminals are robust and provide secure connections, ensuring reliability in operation.
The nominal supply voltage of 1.8V is a commonly used standard, making it compatible with a wide range of systems.
Support for multiple power supply voltages allows flexibility in design and compatibility with different voltage requirements.
Sufficient number of terminals for connecting the device to other components in the system.
Flash PLD technology enables reprogrammability, allowing for quick and easy updates or changes to the logic configuration.
Flatpack thin profile package style saves space and enhances the overall compactness of the product.
In-system programmability allows for convenient programming and reconfiguration of the device without needing to remove it from the system.
Macrocell output function provides flexibility in implementing complex logic operations and functions.
Operates reliably even at low supply voltages, ensuring consistent performance in varying operating conditions.
High maximum operating temperature range allows for use in a variety of environments without risk of overheating.
Compact terminal pitch enables high-density mounting and efficient use of board space.
Configuration with dedicated inputs and a high number of I/O lines enables versatile connectivity and logic functions.
Low minimum operating temperature allows for reliable operation even in cold environments or during temperature fluctuations.
Matte tin finishing provides good electrical conductivity and resistance to corrosion, ensuring reliable connections over time.
Quad position terminals allow for stable and secure mounting on the circuit board, reducing the risk of disconnection.
Moisture sensitivity level 3 indicates the product can withstand moderate exposure to moisture during storage or handling.
Low seated height allows for a compact overall design and ease of integration into space-constrained applications.
Compact width dimension enables efficient use of board space and allows for streamlined placement in tight layouts.
A short time at peak reflow temperature ensures efficient soldering and component assembly processes.
High peak reflow temperature tolerance ensures the product can withstand the heat of the reflow soldering process without damage.
Compact length facilitates space-saving design and efficient placement on the circuit board.
JTAG boundary scan test capability allows for easy and comprehensive testing of the device's functionality and connectivity.
A high number of I/O lines provide ample connectivity options for interfacing with external components and systems.
Automotive-grade temperature rating ensures reliable performance in automotive applications where temperature stability is crucial.
Programmable Logic Devices (PLD) XA2C64A-8VQG44Q attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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XA2C64A-8VQG44Q Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
350766-1
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
General Transistor
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
Secos
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
EPM7032SLC44-7N
Altera
The Altera EPM7032SLC44-7N is a 32 macrocell EE PLD with 7.5 ns propagation delay, operating at up to 166.7 MHz clock frequency. It features in-system programmability and 36 I/O lines, suitable for applications requiring fast logic processing and versatile I/O capabilities in commercial-grade environments.
XC9572XL-10VQ44C
Xilinx
Xilinx XC9572XL-10VQ44C is a 3.3V CMOS PLD with 72 macro cells, 34 I/O lines, and 100MHz clock frequency. Ideal for applications requiring fast propagation delay of 10ns, such as in-system programmable devices needing FLASH PLD technology for versatile surface-mount designs.
ATF22V10C-10PC
Atmel
Atmel's ATF22V10C-10PC is a 5.25V CMOS PLD with 10ns propagation delay, ideal for PAL-type applications. Featuring 22 inputs and 10 I/O lines, this FLASH PLD offers a clock frequency of up to 90MHz in commercial temperature grades.
ATF22V10C-5JX
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
ATF1504AS-7AX44
Microchip Technology
Microchip Technology's ATF1504AS-7AX44 is a 64 macro cell EE PLD with 32 inputs/outputs, 7.5 ns propagation delay, and 166.7 MHz clock frequency. Ideal for applications requiring in-system programmability, such as digital logic design and signal processing systems. Package style: flatpack, thin profile; surface mountable with gull wing terminals.
5M570ZT144C5N
Intel
The Intel 5M570ZT144C5N is a FLASH PLD with 440 macro cells, 114 I/O lines, and a max clock frequency of 118.3 MHz. It is ideal for applications requiring fast propagation delay of 17.7 ns, such as high-speed digital circuit designs and embedded systems development. With JTAG boundary scan test capability and in-system programmability, it offers versatile solutions for various electronic projects.
XCR3032XL-10VQG44I
Xilinx XCR3032XL-10VQG44I is a 32 macrocell EE PLD with 36 I/O lines, operating at up to 95 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed logic functions in a compact form factor.
XCR3128XL-10VQ100C
The Xilinx XCR3128XL-10VQ100C is a programmable logic device with 128 macro cells. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for applications requiring in-system programmability and a clock frequency of up to 95MHz.
XC9572XL-7VQ64C
XC9572XL-7VQ64C by Xilinx is a 3.3V PLD with 72 macro cells, 36 inputs/outputs, and 125MHz clock frequency. Ideal for applications requiring in-system programmability, it features a propagation delay of 7.5ns and operates within -40 to +85°C temperature range.
SLG46110V
Dialog Semiconductor
OT PLD; Form Of Terminal: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC12,.06SQ,16;
SLG46620G
Silego Technology
OT PLD; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
EPM7256SRI208-10
The Intel EPM7256SRI208-10 is a 256 macrocell EE PLD with 164 I/O lines, operating at up to 125 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.
EPM570T100C3N
EPM570T100C3N by Intel is a Programmable Logic Device with 440 macro cells, 76 inputs/outputs, and a propagation delay of 5.4 ns. It uses CMOS technology and is suitable for applications requiring in-system programmability and JTAG boundary scan testing in electronic systems.
EPF10K50EQC240-1N
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
LC4256V-75TN100C
Lattice Semiconductor
LC4256V-75TN100C by Lattice Semiconductor is a 3.3V EE PLD with 256 macro cells, 74 inputs, and 64 I/O lines. It has a propagation delay of 7.5 ns and operates at a max clock frequency of 111 MHz. Ideal for applications requiring in-system programmability and high-speed data processing in compact electronic designs.
EPM570T100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPF10K10ATI144-3N
EPF10K10ATI144-3N by Intel is a PLD with 576 logic cells, 0.8 ns propagation delay, and 102 inputs. Ideal for industrial applications requiring high clock frequency (80 MHz) and registered output function in a compact package style. With a wide operating temperature range (-40 to 85 °C), it offers versatile programmable IC solutions.
LC4256V-3FTN256BC
LC4256V-3FTN256BC by Lattice Semiconductor is a 256 macrocell EE PLD with 164 inputs and 160 I/O lines. Featuring a propagation delay of 3 ns, it operates at a max clock frequency of 212 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.
EPF10K30ATI144-3N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC95288XL-7TQ144I
XC95288XL-7TQ144I by Xilinx is a 288 macrocell FLASH PLD with 117 I/O lines, operating at up to 125 MHz. It features a propagation delay of 7.5 ns and can handle a max supply voltage of 3.6 V. Ideal for industrial applications requiring high-speed programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
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XA2C64A-7VQG44I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XA2C64A-7VQG100I
XA2C64A-7VQG100I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, suitable for industrial applications. It operates at a max supply voltage of 1.9 V and supports in-system programmability. With JTAG boundary scan test capability, it offers 64 I/O lines and operates within -40 to 85°C temperature range.
XA2C256-7VQG100I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XA2C256-8TQG144Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XA2C256-8VQG100Q
XA2C256-8VQG100Q by Xilinx is a 256 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 130 MHz clock frequency. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan testing, with a wide temperature range of -40 to 105 °C.
XA2C384-11TQG144Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: FLAT; No. of Terminals: 144; Package Code: QFF; Package Shape: SQUARE;
XA2C256-7VQG100Q
Programmable Logic Devices; Finishing Of Terminal Used: MATTE TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XA2C64A-7VQG44Q
Programmable Logic Devices; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Finishing Of Terminal Used: MATTE TIN;
XA2C64A-8VQG100Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XA2C128-7VQG100I
XA2C128-8VQG100Q
XA2C32A-6VQG44I
XA2C128-8CPG132Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;
XA2C32A-6VQG44Q
Programmable Logic Devices; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: MATTE TIN;
XA2C256-7TQG144I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XA2C32A-7VQG44Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XA2C128-7CPG132I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;
XA2C128-7VQG100Q
Programmable Logic Devices; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: MATTE TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
XA2C384-10TQG144I
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