Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
XA2C64A-8VQG44Q by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, suitable for automotive applications. Operating at -40 to 125 °C, it features in-system programmability and JTAG boundary scan test capability. With a compact form factor of 10x10 mm and low power supplies of 1.5/3.3 V, it offers high performance in a small footprint for various electronic systems.
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This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.
Low propagation delay ensures fast response times, making the product ideal for applications where timing is critical.
Surface mount technology saves space and allows for easy integration into compact designs.
Operates within a safe voltage range, ensuring stability and reliable performance.
The large number of macro cells provides flexibility for complex programmable logic configurations.
Compliance with automotive standards ensures the product is suitable for use in automotive applications.
CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.
Square package shape allows for efficient use of space and easy placement on circuit boards.
Gull wing terminals are robust and provide secure connections, ensuring reliability in operation.
The nominal supply voltage of 1.8V is a commonly used standard, making it compatible with a wide range of systems.
Support for multiple power supply voltages allows flexibility in design and compatibility with different voltage requirements.
Sufficient number of terminals for connecting the device to other components in the system.
Flash PLD technology enables reprogrammability, allowing for quick and easy updates or changes to the logic configuration.
Flatpack thin profile package style saves space and enhances the overall compactness of the product.
In-system programmability allows for convenient programming and reconfiguration of the device without needing to remove it from the system.
Macrocell output function provides flexibility in implementing complex logic operations and functions.
Operates reliably even at low supply voltages, ensuring consistent performance in varying operating conditions.
High maximum operating temperature range allows for use in a variety of environments without risk of overheating.
Compact terminal pitch enables high-density mounting and efficient use of board space.
Configuration with dedicated inputs and a high number of I/O lines enables versatile connectivity and logic functions.
Low minimum operating temperature allows for reliable operation even in cold environments or during temperature fluctuations.
Matte tin finishing provides good electrical conductivity and resistance to corrosion, ensuring reliable connections over time.
Quad position terminals allow for stable and secure mounting on the circuit board, reducing the risk of disconnection.
Moisture sensitivity level 3 indicates the product can withstand moderate exposure to moisture during storage or handling.
Low seated height allows for a compact overall design and ease of integration into space-constrained applications.
Compact width dimension enables efficient use of board space and allows for streamlined placement in tight layouts.
A short time at peak reflow temperature ensures efficient soldering and component assembly processes.
High peak reflow temperature tolerance ensures the product can withstand the heat of the reflow soldering process without damage.
Compact length facilitates space-saving design and efficient placement on the circuit board.
JTAG boundary scan test capability allows for easy and comprehensive testing of the device's functionality and connectivity.
A high number of I/O lines provide ample connectivity options for interfacing with external components and systems.
Automotive-grade temperature rating ensures reliable performance in automotive applications where temperature stability is crucial.
Programmable Logic Devices (PLD) XA2C64A-8VQG44Q attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx
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Power Supplies (V):
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XA2C64A-8VQG44Q Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
MBRA340T3G
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Toshiba
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
Solid State Devices
Dc Components
ATF22V10C-7SX
Atmel
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
EPM240T100I5N
Altera
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Output Function: MACROCELL;
LC4032ZC-75TN48I
Lattice Semiconductor
LC4032ZC-75TN48I by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. Featuring a propagation delay of 7.5 ns, it operates at a max clock frequency of 111 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in various industries.
SLG46620-AG
Renesas Electronics
SLG46620-AG by Renesas Electronics is a PLA-TYPE OT PLD with 18 inputs, 17 I/O lines, and macrocell output function. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 105 °C. Compact package style with small outline, thin profile, and shrink pitch.
LC4032ZC-75MN56C
LC4032ZC-75MN56C by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. It has a propagation delay of 7.5 ns, max clock frequency of 111 MHz, and operates at temperatures from 0 to 90°C. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in compact designs.
ATF22V10C-10SU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
EPM7128STI100-10N
The EPM7128STI100-10N by Altera is a programmable logic device with 128 macro cells. It has a propagation delay of 10 ns and can operate at a maximum clock frequency of 125 MHz. The device supports in-system programming and has 84 I/O lines. It can be powered by 3.3V or 5V supplies and is compatible with CMOS technology. It is commonly used in industrial applications.
EPM1270F256I5N
Intel
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
5M570ZT144I5N
The Intel 5M570ZT144I5N is a FLASH PLD with 440 macro cells, operating at a max clock frequency of 118.3 MHz. With in-system programmability and JTAG boundary scan test support, it is ideal for industrial applications requiring high-speed processing and versatile I/O configurations.
XC2C384-10FTG256C
Xilinx
Xilinx XC2C384-10FTG256C is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83 MHz, with propagation delay of 10 ns. Ideal for applications requiring in-system programmability and JTAG boundary scan test capabilities.
XC2C384-10TQG144C
XC2C384-10TQG144C by Xilinx is a 384 macrocell FLASH PLD with 118 I/O lines, operating at 83 MHz. It features a propagation delay of 10 ns and can be used for applications requiring in-system programmability and JTAG boundary scan testing.
5M1270ZT144I5
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EPM570F256I5N
The Intel EPM570F256I5N is a FLASH PLD with 440 macro cells, 160 I/O lines, and 8.7 ns propagation delay. It is ideal for applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
5M1270ZT144C5
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
5M160ZE64C4
Intel's 5M160ZE64C4 is a FLASH PLD with 54 I/O lines, operating at up to 184.1 MHz clock frequency. With a propagation delay of 7.9 ns and max supply voltage of 1.89 V, it suits applications requiring high-speed data processing in compact electronic systems.
EPM3512AQC208-10N
The Intel EPM3512AQC208-10N is a 512 macrocell EE PLD with 172 I/O lines, 10 ns propagation delay, and in-system programmability. It operates at a max voltage of 3.6 V and temp up to 70°C. Ideal for applications requiring fast logic processing and versatile I/O capabilities in commercial-grade environments.
ATF22V10CQZ-20PI
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
LC4256ZE-7TN144C
LC4256ZE-7TN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay, suitable for applications requiring in-system programmability and 111 MHz clock frequency. With 96 I/O lines, 0.5 mm terminal pitch, and matte tin finish, it offers versatile functionality in compact form factor for various electronic designs.
EPM240F100C5N
Intel's EPM240F100C5N is a PLD with 192 macro cells, 80 inputs/outputs, and 7.5ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile grid array package style.
5M80ZT100C5N
Intel's 5M80ZT100C5N is a PLD with 64 macro cells, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.
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XA2C64A-7VQG44I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XA2C64A-7VQG100I
XA2C64A-7VQG100I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, suitable for industrial applications. It operates at a max supply voltage of 1.9 V and supports in-system programmability. With JTAG boundary scan test capability, it offers 64 I/O lines and operates within -40 to 85°C temperature range.
XA2C256-7VQG100I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XA2C256-8TQG144Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XA2C256-8VQG100Q
XA2C256-8VQG100Q by Xilinx is a 256 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 130 MHz clock frequency. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan testing, with a wide temperature range of -40 to 105 °C.
XA2C384-11TQG144Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: FLAT; No. of Terminals: 144; Package Code: QFF; Package Shape: SQUARE;
XA2C256-7VQG100Q
Programmable Logic Devices; Finishing Of Terminal Used: MATTE TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XA2C64A-7VQG44Q
Programmable Logic Devices; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Finishing Of Terminal Used: MATTE TIN;
XA2C64A-8VQG100Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XA2C128-7VQG100I
XA2C128-8VQG100Q
XA2C32A-6VQG44I
XA2C128-8CPG132Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;
XA2C32A-6VQG44Q
Programmable Logic Devices; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: MATTE TIN;
XA2C256-7TQG144I
XA2C32A-7VQG44Q
FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
XA2C128-7CPG132I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;
XA2C128-7VQG100Q
Programmable Logic Devices; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: MATTE TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
XA2C384-10TQG144I
Supply Digital Components
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Total price ≈ $80,197.29
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