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OMAPL137CZKBD4

Texas Instruments

OMAPL137CZKBD4 by Texas Instruments

OMAPL137CZKBD4 by Texas Instruments is a Digital Signal Processor with 256 terminals in a square package. It operates b/w -40 to 70°C, with power supplies of 1.2V and 1.8/3.3V. Ideal for applications requiring high-performance signal processing in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,892 parts In-Stock

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Vyrian

USA . 3,958 parts In-Stock

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3,958

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One Stop Electronics

USA . 906 parts In-Stock

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$17.000

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906

$17.000

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AZTECH Wire

Italy . 193 parts In-Stock

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$19.296

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193

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Corohmni

South Africa . 717 parts In-Stock

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$23.914

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717

$23.914

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Parana Technologies

USA . 2,231 parts In-Stock

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$75.775

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$75.775

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IDEA Electronic Components Group

UK . 2,192 parts In-Stock

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$85.141

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$80.884

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$76.627

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2,192

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$76.627

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ChromeModa Solutions

Germany . 214 parts In-Stock

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$85.141

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$69.816

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214

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Component Stockers USA

USA . 267 parts In-Stock

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$99.990

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Microchip USA

USA . 4,299 parts In-Stock

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Corphita

USA . 2,005 parts In-Stock

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DigiPath Technology Company

USA . 1,022 parts In-Stock

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$76.763

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Overview

Looking to take your digital signal processing projects to the next level? Look no further than the OMAPL137CZKBD4 by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers once again with this powerful DSP. Whether you're working on audio processing, telecommunications, or industrial automation, this versatile device offers unmatched performance and reliability. Say goodbye to limitations and hello to endless possibilities with the OMAPL137CZKBD4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and ensures a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making it suitable for various applications.

Package Shape: SQUARE

Square package shape facilitates easy placement on circuit boards and enhances space efficiency.

Power Supplies (V): 1.2,1.8/3.3

Multiple voltage options provide flexibility and compatibility with different power systems.

No. of Terminals: 256

The large number of terminals enables versatile connectivity and functionality for complex signal processing tasks.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient thermal management and reliable electrical connections for optimal performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stability and reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in harsh cold environments without impacting performance.

Terminal Finish: TIN SILVER COPPER

Multi-layer terminal finish enhances conductivity and resistance to corrosion, improving overall product reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and ensures efficient heat dissipation during operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures secure soldering and robust assembly for long-term use.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various signal processing tasks, making it suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates good resistance to moisture-related damage, ensuring product longevity and reliability.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137CZKBD4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

OMAPL137CZKBD4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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