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OMAPL137BZKBT3

Texas Instruments

OMAPL137BZKBT3 by Texas Instruments

OMAPL137BZKBT3 by Texas Instruments is a DSP with 16-bit external data bus, 375 MHz clock frequency, and 13-bit address bus width. Ideal for automotive applications due to its low power mode, CMOS technology, and max operating temperature of 125°C.

Median Price

$22.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$22.630

1k+ parts

$20.250

10k+ parts

$19.060

1

-

$22.630

$20.250

$19.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 15 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

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15

$20.000

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-

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DF Sales Co.

USA . 15 parts In-Stock

1+ parts

$20.000

100+ parts

-

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-

10k+ parts

-

15

$20.000

-

-

-

Digiode

USA . 499 parts In-Stock

1+ parts

$23.883

100+ parts

-

1k+ parts

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499

$23.883

-

-

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Vyrian

USA . 6,316 parts In-Stock

1+ parts

-

100+ parts

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6,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 176 parts In-Stock

1+ parts

$11.460

100+ parts

-

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176

$11.460

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Corphita

USA . 999 parts In-Stock

1+ parts

$22.626

100+ parts

-

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999

$22.626

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$29.476

100+ parts

$26.823

1k+ parts

$24.170

10k+ parts

-

1,000

$29.476

$26.823

$24.170

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Parana Technologies

USA . 73 parts In-Stock

1+ parts

$37.939

100+ parts

-

1k+ parts

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10k+ parts

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73

$37.939

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ChromeModa Solutions

Germany . 1,659 parts In-Stock

1+ parts

$42.628

100+ parts

$34.955

1k+ parts

-

10k+ parts

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1,659

$42.628

$34.955

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IDEA Electronic Components Group

UK . 575 parts In-Stock

1+ parts

$42.628

100+ parts

$40.497

1k+ parts

$38.365

10k+ parts

-

575

$42.628

$40.497

$38.365

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Corohmni

South Africa . 2,235 parts In-Stock

1+ parts

$79.455

100+ parts

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10k+ parts

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2,235

$79.455

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DigiPath Technology Company

USA . 1,437 parts In-Stock

1+ parts

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100+ parts

$38.433

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1,437

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$38.433

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Microchip USA

USA . 102 parts In-Stock

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102

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Overview

Unleash the power of cutting-edge technology with the OMAPL137BZKBT3 by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers unparalleled quality and reliability in every product. The OMAPL137BZKBT3 is perfect for applications where high-performance processing is essential, offering customers unmatched value and benefits. Experience seamless operation and superior performance with this top-of-the-line DSP – revolutionize your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring reliability and longevity of the product.

Surface Mount: YES

Surface mount technology makes the product easier to assemble and allows for denser packing of components on a PCB, saving space.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply design and compatibility with a variety of systems.

Address Bus Width: 13

A wider address bus allows for more memory addressing capability, enhancing the processing capabilities of the DSP.

Package Shape: SQUARE

Square packages are easier to handle and store, and they also provide better thermal performance compared to other shapes.

Power Supplies (V): 1.2,1.8/3.3

Multiple power supply options allow for compatibility with different voltage standards and system requirements.

No. of Terminals: 256

Having a higher number of terminals allows for more connections and functionality, making the DSP versatile in various applications.

Package Style (Meter): GRID ARRAY

Grid array packages offer better thermal performance and electrical characteristics, enhancing the overall reliability of the product.

Minimum Supply Voltage: 1.14 V

The lower minimum supply voltage helps in achieving power efficiency and extends the battery life in portable devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the DSP can perform reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at very low temperatures makes the DSP suitable for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity, corrosion resistance, and solderability, ensuring good electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB assembly and potentially allows for a more compact design layout.

Maximum Seated Height: 2.05 mm

The low seated height enables the DSP to be used in slim devices or applications with space constraints.

Width: 17 mm

A compact width dimension makes the DSP easily integrable into various system designs without occupying too much space.

Boundary Scan: YES

Boundary scan capability helps in testing and diagnosing the DSP during production or maintenance, improving reliability and quality control.

External Data Bus Width: 16

A wider data bus allows for faster data transfer and processing, enhancing the performance of the DSP in handling complex algorithms.

Maximum Clock Frequency: 375 MHz

A high maximum clock frequency enables fast signal processing and execution of algorithms, making the DSP suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering of the DSP during assembly, maintaining good connection reliability.

Peak Reflow Temperature °C: 260

Being able to withstand high reflow temperatures ensures the DSP's reliability in the soldering process without performance degradation.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures enhance data transfer efficiency and enable parallel processing, improving overall performance.

Length: 17 mm

A compact length dimension allows for more flexible placement of the DSP on a PCB and saves space in the overall system design.

Temperature Grade: AUTOMOTIVE

Being rated for automotive temperature requirements means the DSP can withstand the temperature variations experienced in automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting various peripheral IC types expands the DSP's connectivity and interfacing capabilities, making it suitable for diverse applications.

Technology: CMOS

Using CMOS technology offers low power consumption, high speed, and compatibility with various integrated circuits, enhancing the overall performance of the DSP.

Terminal Form: BALL

Ball terminals provide secure and reliable connections, especially in applications that require high vibration resistance or thermal cycling.

Nominal Supply Voltage: 1.2 V

Having a standard nominal supply voltage simplifies power supply design and system integration, ensuring compatibility with common voltage standards.

Terminal Pitch: 1 mm

A small terminal pitch allows for high-density mounting on a PCB, maximizing space utilization and enabling compact system designs.

Format: FLOATING POINT

The floating-point format enhances the DSP's ability to handle complex mathematical operations with higher precision and dynamic range.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level ensures proper handling and storage of the DSP during production, preventing moisture-related damage.

Low Power Mode: YES

The low power mode option allows the DSP to operate efficiently in power-saving modes, extending battery life and reducing energy consumption.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137BZKBT3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

375 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137BZKBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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