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OMAP3515ECBB

Texas Instruments

OMAP3515ECBB by Texas Instruments

OMAP3515ECBB by Texas Instruments is a DSP with integrated cache and 32-bit on-chip data RAM. It operates at a max clock frequency of 59 MHz, suitable for applications requiring low power mode and high-speed processing like digital signal processing tasks. The package style is grid array with very thin profile, making it ideal for compact designs in various electronic devices.

Median Price

$42.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 629 parts In-Stock

1+ parts

-

100+ parts

$37.920

1k+ parts

$33.930

10k+ parts

$31.940

629

-

$37.920

$33.930

$31.940

DigiKey

USA . 629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

629

-

-

-

-

Verical

USA . 629 parts In-Stock

1+ parts

-

100+ parts

$47.400

1k+ parts

$42.413

10k+ parts

$39.925

629

-

$47.400

$42.413

$39.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,372 parts In-Stock

1+ parts

$35.416

100+ parts

-

1k+ parts

-

10k+ parts

-

3,372

$35.416

-

-

-

DigiKey Marketplace

USA . 629 parts In-Stock

1+ parts

$38.770

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$38.770

-

-

-

Vyrian

USA . 6,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,466

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,213 parts In-Stock

1+ parts

$33.552

100+ parts

-

1k+ parts

-

10k+ parts

-

2,213

$33.552

-

-

-

Component Stockers USA

USA . 708 parts In-Stock

1+ parts

$37.590

100+ parts

$35.340

1k+ parts

-

10k+ parts

-

708

$37.590

$35.340

-

-

Corohmni

South Africa . 851 parts In-Stock

1+ parts

$49.386

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$49.386

-

-

-

Parana Technologies

USA . 2,368 parts In-Stock

1+ parts

$73.693

100+ parts

-

1k+ parts

-

10k+ parts

-

2,368

$73.693

-

-

-

DigiPath Technology Company

USA . 1,621 parts In-Stock

1+ parts

$81.145

100+ parts

$74.653

1k+ parts

-

10k+ parts

-

1,621

$81.145

$74.653

-

-

ChromeModa Solutions

Germany . 3,172 parts In-Stock

1+ parts

$82.801

100+ parts

$67.897

1k+ parts

-

10k+ parts

-

3,172

$82.801

$67.897

-

-

IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$82.801

100+ parts

$78.661

1k+ parts

$74.521

10k+ parts

-

692

$82.801

$78.661

$74.521

-

Microchip USA

USA . 330 parts In-Stock

1+ parts

$110.520

100+ parts

$109.550

1k+ parts

$109.550

10k+ parts

$108.590

330

$110.520

$109.550

$109.550

$108.590

Overview

Experience cutting-edge technology with the OMAP3515ECBB by Texas Instruments, a leader in digital signal processors. This versatile product is perfect for a wide range of applications, providing seamless integration and high performance. With its integrated cache and low power mode, this DSP offers unmatched value and benefits to customers looking for reliability and efficiency. Trust Texas Instruments to deliver quality and innovation with each product, setting the standard for excellence in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for housing the components of the DSP.

Integrated Cache: YES

Improves the processing speed and efficiency by storing frequently used data for quick access.

Maximum Supply Voltage: 1.91 V

Provides a sufficient voltage for the DSP to operate at optimal performance levels.

On Chip Data RAM Width: 32

Allows for faster data processing and storage capabilities within the chip itself.

Surface Mount: YES

Enables easy and secure installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Optimal shape for efficient component layout and space utilization on the PCB.

Power Supplies (V): 1.1,1.8,3.3

Offers flexibility in power requirements to suit various application needs.

No. of Terminals: 515

Sufficient terminals for connecting the DSP to other components in the system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enhances the overall manufacturing process and PCB assembly by providing a compact and efficient package style.

Minimum Supply Voltage: 1.71 V

Ensures the DSP operates within the specified voltage range for reliable performance.

Maximum Operating Temperature: 90 °C

Capable of withstanding high temperatures, making it suitable for a wide range of environments.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature conditions, ensuring reliability in various settings.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides a durable and reliable finish for the terminals, ensuring good electrical conductivity.

Terminal Position: BOTTOM

Facilitates easy and secure connection to the PCB, enhancing stability during operation.

Maximum Seated Height: 0.9 mm

Low profile design for compact PCB layouts and space-constrained applications.

RAM Words: 32768

Sufficient memory capacity for storing and processing data efficiently within the DSP.

Width: 12 mm

Compact size for easy integration into various electronic devices.

Boundary Scan: YES

Facilitates testing and debugging during manufacturing, ensuring product quality and reliability.

Maximum Clock Frequency: 59 MHz

High clock frequency for fast data processing and real-time operations.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the reflow soldering process.

Internal Bus Architecture: SINGLE

Simplified bus structure for efficient data transfer and processing within the DSP.

Length: 12 mm

Compact size for space-saving and versatile integration in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile IC type suitable for various signal processing applications.

No. of Timers: 15

Multiple timers for synchronization and time-sensitive operations in the system.

Technology: CMOS

Low power consumption and high integration capabilities for efficient operation.

Terminal Form: BALL

Ball terminal form for reliable and secure connection to the PCB.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent and reliable performance of the DSP.

No. of DMA Channels: 32

Multiple DMA channels for efficient data transfer and processing without CPU intervention.

ROM Programmability: MROM

Mask ROM for secure and permanent storage of program code in the DSP.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density PCB designs and space optimization.

Format: FLOATING POINT

Supports floating-point calculations for accurate and precise signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture during storage and handling.

Speed: 720 rpm

High speed for efficient data processing and real-time signal processing applications.

Low Power Mode: YES

Energy-efficient low power mode for power-saving and extended battery life in portable devices.

On Chip Program ROM Width: 32

On-chip ROM for storing program code directly on the DSP for faster data access and execution.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3515ECBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

515

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

.9 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP3515ECBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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