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MSP430F67791IPZR

Texas Instruments

MSP430F67791IPZR by Texas Instruments

MSP430F67791IPZR by Texas Instruments is a 16-bit MCU with 524288 ROM words and 32 RAM words. Operating at -40 to 85 °C, it features ADC channels, I2C/SPI/UART compatibility, and low power consumption. Ideal for industrial applications requiring a compact form factor and high performance.

Median Price

$8.551

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,750 parts In-Stock

1+ parts

$8.551

100+ parts

$7.469

1k+ parts

$5.151

10k+ parts

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8,750

$8.551

$7.469

$5.151

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,556 parts In-Stock

1+ parts

$8.123

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-

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1,556

$8.123

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Vyrian

USA . 2,890 parts In-Stock

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2,890

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Chip Stock

USA . 725 parts In-Stock

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725

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Distributors (Availability)

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Corphita

USA . 1,583 parts In-Stock

1+ parts

$7.696

100+ parts

-

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1,583

$7.696

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Corohmni

South Africa . 3,136 parts In-Stock

1+ parts

$7.878

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-

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3,136

$7.878

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$18.590

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760

$18.590

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Parana Technologies

USA . 77 parts In-Stock

1+ parts

$76.690

100+ parts

-

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77

$76.690

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DigiPath Technology Company

USA . 529 parts In-Stock

1+ parts

$84.446

100+ parts

$77.690

1k+ parts

-

10k+ parts

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529

$84.446

$77.690

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ChromeModa Solutions

Germany . 1,769 parts In-Stock

1+ parts

$86.169

100+ parts

$70.659

1k+ parts

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1,769

$86.169

$70.659

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$86.169

100+ parts

$81.861

1k+ parts

$77.552

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837

$86.169

$81.861

$77.552

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Lixinc

USA . 10,119 parts In-Stock

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10,119

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1,257 parts In-Stock

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1,257

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Component Stockers USA

USA . 206 parts In-Stock

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206

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Overview

Experience the next level of innovation with the MSP430F67791IPZR by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this product is designed to meet the demands of today's fast-paced technological landscape. Unlock new possibilities and streamline your projects with the MSP430F67791IPZR, delivering exceptional value and efficiency to customers looking to stay ahead of the curve. Elevate your designs with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Enables easy and convenient integration onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for a wide operating voltage range, making the IC versatile and compatible with different power supply configurations.

Bit Size: 16

Offers a good balance between processing power and complexity, suitable for a range of applications without being overly resource-intensive.

No. of Terminals: 100

Provides sufficient connectivity options for interfacing with other components, peripherals, and external devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in high-temperature environments, making the IC suitable for industrial applications.

CPU Family: MSP430

Indicates a well-established and reliable processor family known for its low power consumption and high performance, making the IC energy-efficient.

RAM Words: 32

Sufficient RAM capacity for handling data processing tasks efficiently without overwhelming the system.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates various peripheral interfaces and functionalities to support a wide range of applications and external devices.

Technology: CMOS

Features low power consumption and high noise immunity characteristics, enhancing the overall efficiency and reliability of the IC.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67791IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67791IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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