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MSP430F6778AIPEU

Texas Instruments

MSP430F6778AIPEU by Texas Instruments

MSP430F6778AIPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, 524288 ROM words, and 6-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

758

$12.976

$11.335

$7.817

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,149 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

-

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4,149

$12.327

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-

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Vyrian

USA . 4,468 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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4,468

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$8.240

100+ parts

-

1k+ parts

-

10k+ parts

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360

$8.240

-

-

-

Ampacity Inc.

Singapore . 524 parts In-Stock

1+ parts

$11.030

100+ parts

-

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-

10k+ parts

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524

$11.030

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Corphita

USA . 2,270 parts In-Stock

1+ parts

$11.678

100+ parts

-

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2,270

$11.678

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Parana Technologies

USA . 964 parts In-Stock

1+ parts

$24.993

100+ parts

-

1k+ parts

$25.690

10k+ parts

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964

$24.993

-

$25.690

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DigiPath Technology Company

USA . 1,004 parts In-Stock

1+ parts

$27.520

100+ parts

$25.319

1k+ parts

-

10k+ parts

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1,004

$27.520

$25.319

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ChromeModa Solutions

Germany . 6,956 parts In-Stock

1+ parts

$28.082

100+ parts

$23.027

1k+ parts

-

10k+ parts

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6,956

$28.082

$23.027

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$28.082

100+ parts

$26.678

1k+ parts

$25.274

10k+ parts

-

1,691

$28.082

$26.678

$25.274

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Microchip USA

USA . 2,087 parts In-Stock

1+ parts

$40.900

100+ parts

$40.310

1k+ parts

$40.020

10k+ parts

$39.730

2,087

$40.900

$40.310

$40.020

$39.730

Corohmni

South Africa . 5,008 parts In-Stock

1+ parts

$67.571

100+ parts

-

1k+ parts

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10k+ parts

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5,008

$67.571

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Component Stockers USA

USA . 877 parts In-Stock

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877

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Overview

Unleash the full potential of your projects with the MSP430F6778AIPEU by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments has once again delivered a cutting-edge solution in the category of Other Function uPs,uCs & Peripheral ICs. With advanced features like ADC channels, DMA channels, and PWM channels, this microprocessor circuit offers unparalleled performance and versatility. Whether you're working on industrial automation, smart devices, or consumer electronics, the MSP430F6778AIPEU provides the perfect balance of power and efficiency to bring your ideas to life. Upgrade to Texas Instruments and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring reliable performance over time.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power requirements and compatibility with a wide range of applications.

Bit Size: 16

Offers high processing capability and efficiency for handling complex tasks and calculations.

ADC Channels: YES

Enables the IC to convert analog signals into digital data, expanding its capabilities for sensor integration and data acquisition.

Maximum Clock Frequency: 0.032768 MHz

Provides fast processing speed for real-time applications and efficient performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates various peripheral interfaces and functions to enhance the overall functionality of the IC.

Nominal Supply Voltage: 3.3 V

Offers stable and reliable power input for consistent operation and performance.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Supports multiple communication protocols for seamless integration with other devices and systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6778AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6778AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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