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MSP430F67781IPZR

Texas Instruments

MSP430F67781IPZR by Texas Instruments

MSP430F67781IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,111 parts In-Stock

1+ parts

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2,111

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Digiode

USA . 569 parts In-Stock

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569

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$14.355

100+ parts

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573

$14.355

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Parana Technologies

USA . 1,388 parts In-Stock

1+ parts

$28.726

100+ parts

-

1k+ parts

$51.082

10k+ parts

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1,388

$28.726

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$51.082

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ChromeModa Solutions

Germany . 6,982 parts In-Stock

1+ parts

$32.276

100+ parts

$26.466

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6,982

$32.276

$26.466

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IDEA Electronic Components Group

UK . 270 parts In-Stock

1+ parts

$32.276

100+ parts

$30.662

1k+ parts

$29.048

10k+ parts

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270

$32.276

$30.662

$29.048

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One Stop Electronics

USA . 1,394 parts In-Stock

1+ parts

$33.000

100+ parts

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1,394

$33.000

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Corohmni

South Africa . 156 parts In-Stock

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$52.107

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156

$52.107

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Corphita

USA . 1,131 parts In-Stock

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1,131

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DigiPath Technology Company

USA . 226 parts In-Stock

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$29.100

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226

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$29.100

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Microchip USA

USA . 183 parts In-Stock

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183

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Overview

Unlock endless possibilities with the MSP430F67781IPZR by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. Designed for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this innovative product offers unparalleled value to customers seeking efficiency and performance. With advanced technology and a robust design, the MSP430F67781IPZR delivers unmatched benefits, making it the ideal choice for your next project. Experience the advantages of this cutting-edge microprocessor circuit today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good physical protection for the internal components of the IC, making it durable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the IC onto a PCB, reducing assembly time and costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, making it versatile and adaptable.

Package Shape: SQUARE

A square package shape allows for easier PCB layout and routing, optimizing space and improving overall design efficiency.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities and performance, making this IC suitable for complex applications.

Power Supplies (V): 2/3.3

The dual power supply support of 2V and 3.3V gives flexibility in powering the IC, enabling it to be used in a variety of systems.

No. of Terminals: 100

Having a high number of terminals allows for multiple input and output connections, enabling the IC to interface with other components effectively.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and slim design with fine pitch terminals, reducing the overall size of the IC and enhancing PCB layout capabilities.

Minimum Supply Voltage: 1.8 V

With a low minimum supply voltage requirement, this IC can operate efficiently even with lower power sources, improving energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in harsh industrial environments where temperature variations are common.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates high-quality standards, advanced features, and compatibility with a range of development tools and software.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability allows the IC to function effectively in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, enhancing overall product reliability.

Terminal Position: QUAD

The quad terminal position arrangement simplifies PCB soldering and rework processes, reducing assembly time and improving production efficiency.

ROM Words: 524288

The large ROM capacity of 524288 words allows for storing extensive program data and instructions, enabling the IC to handle complex computational tasks efficiently.

Maximum Seated Height: 1.6 mm

A low maximum seated height facilitates a compact design profile, reducing the overall size of the product and enhancing space-saving capabilities.

Width: 14 mm

With a moderate width of 14mm, this IC can fit easily into standard PCB layouts and designs, ensuring compatibility with a variety of system configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance of 260°C, the IC can endure soldering processes without damage, ensuring robust assembly and reliability.

Length: 14 mm

A compact length of 14mm allows for efficient board space utilization and compact system designs, enabling versatile integration into various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that the IC is suitable for operation in demanding industrial environments with extended temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC offers advanced processing capabilities and integrated peripherals, making it suitable for complex control and computation tasks.

RAM Bytes: 16384

With 16384 bytes of RAM, the IC can efficiently handle data storage and processing requirements, ensuring smooth and responsive operation in various applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and versatile digital functionality, making the IC energy-efficient and reliable in operation.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and rework processes, ensuring reliable electrical connections and simplifying assembly and maintenance.

Maximum Supply Current: 11.75 mA

A low maximum supply current of 11.75mA allows for efficient power usage, prolonging battery life and reducing overall energy consumption.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable and consistent power delivery to the IC, ensuring reliable and consistent performance throughout operation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and customization, enabling quick adaptation to changing requirements and improved functionality.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and space-efficient PCB layouts, optimizing system design and integration capabilities.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the IC is moisture-resistant and can withstand moderate exposure to humidity, ensuring long-term reliability in various environmental conditions.

Speed: 25 rpm

The speed rating of 25 rpm signifies the processing speed of the IC, indicating its ability to handle tasks efficiently and deliver high-performance computing capabilities.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67781IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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