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MSP430F67781AIPEU

Texas Instruments

MSP430F67781AIPEU by Texas Instruments

MSP430F67781AIPEU by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,311 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

2,311

$12.976

$11.335

$7.817

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$11.139

100+ parts

-

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-

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65

$11.139

-

-

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Digiode

USA . 4,030 parts In-Stock

1+ parts

$12.327

100+ parts

-

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-

10k+ parts

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4,030

$12.327

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Vyrian

USA . 7,306 parts In-Stock

1+ parts

-

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7,306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,281 parts In-Stock

1+ parts

$11.030

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-

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2,281

$11.030

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Semicontronic

India . 2,067 parts In-Stock

1+ parts

$11.030

100+ parts

$10.754

1k+ parts

$10.699

10k+ parts

-

2,067

$11.030

$10.754

$10.699

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Continental Prestige Electronics

USA . 6,863 parts In-Stock

1+ parts

$11.139

100+ parts

-

1k+ parts

-

10k+ parts

$10.916

6,863

$11.139

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-

$10.916

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$11.139

100+ parts

-

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2,000

$11.139

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Corphita

USA . 3,642 parts In-Stock

1+ parts

$11.678

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3,642

$11.678

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AZTECH Wire

Italy . 1,103 parts In-Stock

1+ parts

$14.710

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1,103

$14.710

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Microchip USA

USA . 2,628 parts In-Stock

1+ parts

$40.900

100+ parts

$40.310

1k+ parts

$40.020

10k+ parts

$39.730

2,628

$40.900

$40.310

$40.020

$39.730

Corohmni

South Africa . 2,506 parts In-Stock

1+ parts

$51.621

100+ parts

-

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2,506

$51.621

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Parana Technologies

USA . 317 parts In-Stock

1+ parts

$63.243

100+ parts

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317

$63.243

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DigiPath Technology Company

USA . 1,481 parts In-Stock

1+ parts

$69.639

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1,481

$69.639

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ChromeModa Solutions

Germany . 2,364 parts In-Stock

1+ parts

$71.060

100+ parts

$58.269

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2,364

$71.060

$58.269

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IDEA Electronic Components Group

UK . 1,222 parts In-Stock

1+ parts

$71.060

100+ parts

$67.507

1k+ parts

$63.954

10k+ parts

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1,222

$71.060

$67.507

$63.954

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Argo Parts USA

USA . 1,060 parts In-Stock

1+ parts

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1,060

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Overview

Discover the innovative MSP430F67781AIPEU by Texas Instruments, a top-quality microprocessor circuit designed to elevate your projects to new heights. With a wide range of applications in various industries, this device boasts impressive features and benefits that ensure optimal performance and reliability. From its advanced technology to its superior connectivity options, this product offers unmatched value to customers seeking cutting-edge solutions. Experience the power of Texas Instruments and take your designs to the next level with the MSP430F67781AIPEU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount capability allows for easy integration into circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is practical for efficient layout on PCBs, optimizing space utilization and simplifying design.

Bit Size: 16

With a bit size of 16, this product offers sufficient processing power for handling complex tasks efficiently.

No. of Terminals: 128

The ample number of terminals allows for versatile connectivity options, enabling the product to interface with multiple external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor with a low profile and fine pitch, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures efficient operation even in environments with limited power availability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in demanding conditions without risking overheating.

CPU Family: MSP430

Being part of the MSP430 CPU family signifies efficient power management and low energy consumption, making it an energy-efficient choice.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function reliably in extreme cold environments.

ADC Channels: YES

The inclusion of ADC channels enables the product to accurately convert analog signals into digital data, expanding its sensing capabilities.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The presence of a microprocessor circuit in this product enables advanced control and processing capabilities, enhancing its functionality.

PWM Channels: YES

PWM channels offer precise control over the output signal's duty cycle, making this product suitable for applications requiring accurate pulse modulation.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The diverse connectivity options allow the product to communicate with a wide range of external devices, promoting interoperability.

ROM Programmability: FLASH

The programmable ROM with flash memory technology enables easy and flexible firmware updates, ensuring adaptability to changing requirements.

No. of I/O Lines: 90

With 90 I/O lines, this product offers extensive input/output capabilities, enabling versatile interfacing with external components.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67781AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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