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MSP430F6777IPZ

Texas Instruments

MSP430F6777IPZ by Texas Instruments

MSP430F6777IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it is ideal for industrial applications requiring low power consumption and high performance. With ADC channels, I2C/SPI/UART compatibility, and a compact form factor, it offers versatile solutions in various embedded systems.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 915 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

915

$8.955

$7.301

$4.867

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,837 parts In-Stock

1+ parts

$8.507

100+ parts

-

1k+ parts

-

10k+ parts

-

4,837

$8.507

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Vyrian

USA . 6,353 parts In-Stock

1+ parts

-

100+ parts

-

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-

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6,353

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Infinite Electronics LLP

India . 394 parts In-Stock

1+ parts

-

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-

1k+ parts

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394

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,730 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,730

$8.060

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-

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Corohmni

South Africa . 1,206 parts In-Stock

1+ parts

$10.393

100+ parts

-

1k+ parts

-

10k+ parts

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1,206

$10.393

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-

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$17.820

100+ parts

-

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10k+ parts

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374

$17.820

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-

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Parana Technologies

USA . 1,809 parts In-Stock

1+ parts

$26.011

100+ parts

$2,415.529

1k+ parts

$23.410

10k+ parts

-

1,809

$26.011

$2,415.529

$23.410

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DigiPath Technology Company

USA . 959 parts In-Stock

1+ parts

$28.641

100+ parts

-

1k+ parts

-

10k+ parts

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959

$28.641

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-

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ChromeModa Solutions

Germany . 1,296 parts In-Stock

1+ parts

$29.226

100+ parts

$23.965

1k+ parts

-

10k+ parts

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1,296

$29.226

$23.965

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IDEA Electronic Components Group

UK . 347 parts In-Stock

1+ parts

$29.226

100+ parts

$27.765

1k+ parts

$26.303

10k+ parts

-

347

$29.226

$27.765

$26.303

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$37.302

100+ parts

$33.945

1k+ parts

$30.588

10k+ parts

-

500

$37.302

$33.945

$30.588

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Overview

Experience the cutting-edge technology of the MSP430F6777IPZ by Texas Instruments, a high-quality microprocessor circuit that offers unparalleled performance and reliability. Designed with precision and expertise, this processor is perfect for a wide range of applications, from IoT devices to industrial automation. With its advanced features and innovative design, customers can expect seamless operation, efficient power management, and optimal functionality. Trust Texas Instruments to deliver unparalleled value and benefits with the MSP430F6777IPZ, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications without risking damage to the IC due to overvoltage.

Package Shape: SQUARE

Facilitates efficient layout and space utilization on the PCB, enabling compact designs.

Bit Size: 16

Offers enhanced processing capabilities and allows for handling complex algorithms and data types.

Power Supplies (V): 2/3.3

Provides flexibility in power requirements, enabling compatibility with different power sources.

No. of Terminals: 100

Offers ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables space-saving and efficient PCB design, ideal for compact electronic devices.

Minimum Supply Voltage: 1.8 V

Supports low-power operation and extends battery life in portable or energy-efficient applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in elevated temperature environments, suitable for industrial applications.

CPU Family: MSP430

Utilizes a well-established and reliable microcontroller architecture, ensuring stable operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6777IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6777IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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