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MSP430F6777AIPEUR

Texas Instruments

MSP430F6777AIPEUR by Texas Instruments

MSP430F6777AIPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.654

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,300 parts In-Stock

1+ parts

$7.169

100+ parts

$5.844

1k+ parts

$3.896

10k+ parts

-

3,300

$7.169

$5.844

$3.896

-

DigiKey

USA . 1,451 parts In-Stock

1+ parts

$10.140

100+ parts

$6.749

1k+ parts

$6.194

10k+ parts

$6.065

1,451

$10.140

$6.749

$6.194

$6.065

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,175 parts In-Stock

1+ parts

$6.811

100+ parts

-

1k+ parts

-

10k+ parts

-

3,175

$6.811

-

-

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Chip Stock

USA . 9,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,190

-

-

-

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Vyrian

USA . 3,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,558

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,547 parts In-Stock

1+ parts

$6.452

100+ parts

-

1k+ parts

-

10k+ parts

-

4,547

$6.452

-

-

-

Parana Technologies

USA . 2,262 parts In-Stock

1+ parts

$44.048

100+ parts

-

1k+ parts

-

10k+ parts

-

2,262

$44.048

-

-

-

DigiPath Technology Company

USA . 1,520 parts In-Stock

1+ parts

$48.502

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

$48.502

-

-

-

ChromeModa Solutions

Germany . 821 parts In-Stock

1+ parts

$49.492

100+ parts

$40.583

1k+ parts

-

10k+ parts

-

821

$49.492

$40.583

-

-

IDEA Electronic Components Group

UK . 487 parts In-Stock

1+ parts

$49.492

100+ parts

$47.017

1k+ parts

$44.543

10k+ parts

-

487

$49.492

$47.017

$44.543

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Corohmni

South Africa . 3,206 parts In-Stock

1+ parts

$68.962

100+ parts

-

1k+ parts

-

10k+ parts

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3,206

$68.962

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6777AIPEUR. Crafted with top-notch quality and precision by a renowned manufacturer, this product belongs to the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for various applications. Experience unparalleled value with its advanced features like ADC Channels, DMA Channels, and PWM Channels, providing users with seamless connectivity and efficient performance. Elevate your projects with this innovative microprocessor circuit that guarantees reliability and excellence. Choose the MSP430F6777AIPEUR and revolutionize the way you create and innovate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various environmental conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for versatility in power options and compatibility with different systems.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and higher data precision.

ADC Channels: YES

Built-in Analog to Digital Converters enable the device to sense and convert analog signals into digital data for processing.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options allow for seamless communication with other devices and peripherals, enhancing overall system integration.

ROM Programmability: FLASH

FLASH ROM allows for easy and flexible reprogramming of the device, making it adaptable for different applications and updates.

Speed: 25 rpm

The 25 revolutions per minute speed capability ensures efficient data processing and response times.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6777AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6777AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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