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MSP430F67771IPEU

Texas Instruments

MSP430F67771IPEU by Texas Instruments

MSP430F67771IPEU by Texas Instruments is a 16-bit MCU with 262144 ROM words, 32 RAM words, and 32768 RAM bytes. It operates b/w -40 to 85 °C and supports I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$19.363

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,616 parts In-Stock

1+ parts

$15.036

100+ parts

$12.258

1k+ parts

$8.172

10k+ parts

-

1,616

$15.036

$12.258

$8.172

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$23.690

100+ parts

$14.580

1k+ parts

$14.410

10k+ parts

-

3

$23.690

$14.580

$14.410

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 242 parts In-Stock

1+ parts

$14.284

100+ parts

-

1k+ parts

-

10k+ parts

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242

$14.284

-

-

-

Vyrian

USA . 4,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,827

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,820 parts In-Stock

1+ parts

$13.532

100+ parts

-

1k+ parts

-

10k+ parts

-

2,820

$13.532

-

-

-

Corohmni

South Africa . 5,229 parts In-Stock

1+ parts

$17.061

100+ parts

-

1k+ parts

-

10k+ parts

-

5,229

$17.061

-

-

-

Parana Technologies

USA . 1,246 parts In-Stock

1+ parts

$20.634

100+ parts

-

1k+ parts

$20.739

10k+ parts

-

1,246

$20.634

-

$20.739

-

DigiPath Technology Company

USA . 1,631 parts In-Stock

1+ parts

$22.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,631

$22.720

-

-

-

ChromeModa Solutions

Germany . 2,724 parts In-Stock

1+ parts

$23.184

100+ parts

$19.011

1k+ parts

-

10k+ parts

-

2,724

$23.184

$19.011

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

1+ parts

$23.184

100+ parts

$22.025

1k+ parts

$20.866

10k+ parts

-

1,303

$23.184

$22.025

$20.866

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Microchip USA

USA . 2,379 parts In-Stock

1+ parts

$44.448

100+ parts

-

1k+ parts

-

10k+ parts

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2,379

$44.448

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

-

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Overview

Unlock the power of innovative technology with the Texas Instruments MSP430F67771IPEU, a cutting-edge microprocessor circuit designed for a wide range of applications. With a focus on quality and reliability, Texas Instruments delivers unparalleled value to customers looking for high-performance solutions. Ideal for various functions, this product offers a seamless experience with its advanced features and benefits. Experience next-level performance and efficiency with the MSP430F67771IPEU by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for various environments.

Surface Mount: YES

Surface mount technology ensures easy and efficient assembly of the product onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile in different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement of the product onto circuit boards, optimizing space usage in electronic devices.

Bit Size: 16

A 16-bit architecture allows for faster and more efficient processing of data, enhancing the overall performance of the product.

Power Supplies (V): 2/3.3

Dual power supply options provide flexibility and compatibility with different voltage requirements, making it suitable for a variety of systems.

No. of Terminals: 128

With a high number of terminals, this product offers ample connectivity options for peripherals and external components, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures a compact and space-saving design, ideal for applications where size and weight are critical factors.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for efficient power consumption and operation, making the product energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in challenging environmental conditions, suitable for industrial applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67771IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67771IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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