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MSP430F6776IPZR

Texas Instruments

MSP430F6776IPZR by Texas Instruments

MSP430F6776IPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words, 16384 RAM bytes, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,207 parts In-Stock

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Digiode

USA . 2,978 parts In-Stock

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AZTECH Wire

Italy . 293 parts In-Stock

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$17.122

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One Stop Electronics

USA . 692 parts In-Stock

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$22.000

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Corohmni

South Africa . 702 parts In-Stock

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$22.933

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Parana Technologies

USA . 2,371 parts In-Stock

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$72.864

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DigiPath Technology Company

USA . 2,017 parts In-Stock

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$80.233

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$73.814

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ChromeModa Solutions

Germany . 5,865 parts In-Stock

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$81.870

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$67.133

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IDEA Electronic Components Group

UK . 1,634 parts In-Stock

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$81.870

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$77.776

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$73.683

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Corphita

USA . 2,186 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the MSP430F6776IPZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. The MSP430F6776IPZR falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a versatile solution for a variety of applications. With its advanced technology and reliable performance, this product provides customers with unparalleled value, benefits, and advantages. Experience efficiency and functionality like never before with the MSP430F6776IPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the product.

Surface Mount: YES

Surface mount technology ensures easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for versatility in power source options for the product.

Package Shape: SQUARE

Square package shape provides uniformity and ease of integration into electronic systems.

Bit Size: 16

16-bit size offers enhanced processing capabilities for the product.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for flexibility in powering the product.

No. of Terminals: 100

Ample number of terminals enable various connections and interfaces for the product.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style allows for compact design and efficient board layout.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage ensures energy efficiency and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility with existing hardware and software ecosystems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range makes the product suitable for harsh cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance for terminal connections.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals and connections within the product.

ROM Words: 262144

Large ROM capacity enables storing a significant amount of program data for the product.

Maximum Seated Height: 1.6 mm

Low maximum seated height facilitates slim and compact product design.

Width: 14 mm

Standard width dimension ensures compatibility with industry-standard mounting configurations.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency supports fast data processing and operations for the product.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for thorough solder reflow during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component attachment during assembly.

Length: 14 mm

Standard length dimension ensures compatibility with industry-standard mounting configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robust performance in harsh operating environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Utilizing a microprocessor circuit as a peripheral IC type allows for advanced computing capabilities and connectivity.

RAM Bytes: 16384

Significant RAM capacity enables efficient data processing and storage for the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for the product.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable connections during product usage.

Maximum Supply Current: 11.75 mA

Low maximum supply current requirement indicates energy efficiency and minimal power consumption.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage provides consistent power delivery for the product.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of program data on the product.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus interfaces enhances connectivity and communication options for the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and optimized PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture during handling and storage.

Speed: 25 rpm

Operating at 25 rpm speed ensures efficient data processing and system responsiveness.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6776IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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