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MSP430F6776IPEUR

Texas Instruments

MSP430F6776IPEUR by Texas Instruments

MSP430F6776IPEUR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it supports I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.592

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,983 parts In-Stock

1+ parts

$7.592

100+ parts

$6.189

1k+ parts

$4.126

10k+ parts

-

2,983

$7.592

$6.189

$4.126

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,799 parts In-Stock

1+ parts

$7.212

100+ parts

-

1k+ parts

-

10k+ parts

-

4,799

$7.212

-

-

-

Vyrian

USA . 6,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,420

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 706 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

-

10k+ parts

-

706

$6.555

-

-

-

Corphita

USA . 3,263 parts In-Stock

1+ parts

$6.833

100+ parts

-

1k+ parts

-

10k+ parts

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3,263

$6.833

-

-

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AZTECH Wire

Italy . 816 parts In-Stock

1+ parts

$19.660

100+ parts

-

1k+ parts

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10k+ parts

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816

$19.660

-

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Microchip USA

USA . 3,195 parts In-Stock

1+ parts

$20.889

100+ parts

-

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10k+ parts

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3,195

$20.889

-

-

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Parana Technologies

USA . 1,613 parts In-Stock

1+ parts

$68.575

100+ parts

-

1k+ parts

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10k+ parts

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1,613

$68.575

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DigiPath Technology Company

USA . 2,017 parts In-Stock

1+ parts

$75.510

100+ parts

$69.469

1k+ parts

-

10k+ parts

-

2,017

$75.510

$69.469

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ChromeModa Solutions

Germany . 4,921 parts In-Stock

1+ parts

$77.051

100+ parts

$63.182

1k+ parts

-

10k+ parts

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4,921

$77.051

$63.182

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IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$77.051

100+ parts

$73.198

1k+ parts

$69.346

10k+ parts

-

54

$77.051

$73.198

$69.346

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Component Stockers USA

USA . 1,412 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,412

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6776IPEUR. Known for its superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. This versatile microprocessor circuit is perfect for a wide range of applications, offering high performance and efficiency. Say goodbye to limitations and hello to innovation with the MSP430F6776IPEUR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable, this product is easier to install on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board.

Bit Size: 16

The 16-bit size provides enhanced processing capability and precision for applications that require it.

Power Supplies (V): 2/3.3

The availability of multiple power supply options (2V and 3.3V) allows for flexibility in powering the product.

No. of Terminals: 128

Having 128 terminals enables connectivity to various other components and peripherals, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style improves thermal conductivity and helps in space-constrained designs.

Minimum Supply Voltage: 1.8 V

Despite the high maximum supply voltage, the low minimum supply voltage allows for operation in lower power settings.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

CPU Family: MSP430

The use of MSP430 CPU family indicates a proven and reliable microcontroller architecture for this product.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, making this product suitable for applications requiring sensor inputs.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and secure attachment to the circuit board.

ROM Words: 262144

With a large ROM capacity of 262144 words, this product can store a significant amount of program data.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables slim and compact design integration in electronic devices.

RAM Words: 16

While the ROM capacity is high, the RAM capacity of 16 words provides ample volatile memory for efficient data processing.

Width: 14 mm

The compact width of 14mm allows for easy placement and integration into circuit board layouts.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, this product offers fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective soldering of the product onto the circuit board.

Length: 20 mm

The moderate length of 20mm provides a balanced form factor for easy integration in various electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand tough operating conditions and temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type of microprocessor circuit expands the functionality and processing capabilities of this product.

RAM Bytes: 16384

With a RAM capacity of 16384 bytes, this product can efficiently handle and manipulate data in volatile memory.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment and reliable connection to the circuit board.

Maximum Supply Current: 11.75 mA

With a maximum supply current of 11.75 mA, this product operates efficiently without drawing excessive power.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power delivery to the product.

ROM Programmability: FLASH

The ROM programmability using flash memory allows for easy and quick updates to the program data.

Bus Compatibility: I2C; SPI; UART

Compatibility with I2C, SPI, and UART buses enables seamless integration with various communication protocols and peripherals.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm facilitates precise soldering and connection to the circuit board.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate exposure to moisture during storage and handling.

Speed: 25 rpm

The speed specification of 25 rpm may not be relevant to this product category and may need further clarification.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6776IPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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