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MSP430F67761IPZR

Texas Instruments

MSP430F67761IPZR by Texas Instruments

MSP430F67761IPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it's ideal for industrial applications requiring low power consumption and high performance in a compact FLATPACK package. With a max supply voltage of 3.6 V, it offers versatile functionality for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,280 parts In-Stock

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Digiode

USA . 1,176 parts In-Stock

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1,176

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Distributors (Availability)

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One Stop Electronics

USA . 499 parts In-Stock

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$12.000

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499

$12.000

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AZTECH Wire

Italy . 327 parts In-Stock

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$15.340

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327

$15.340

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Parana Technologies

USA . 240 parts In-Stock

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$46.080

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240

$46.080

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DigiPath Technology Company

USA . 1,939 parts In-Stock

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$50.740

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$46.680

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1,939

$50.740

$46.680

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ChromeModa Solutions

Germany . 2,604 parts In-Stock

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$51.775

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$42.456

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2,604

$51.775

$42.456

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IDEA Electronic Components Group

UK . 2,367 parts In-Stock

1+ parts

$51.775

100+ parts

$49.186

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$46.598

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2,367

$51.775

$49.186

$46.598

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Corohmni

South Africa . 2,201 parts In-Stock

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$52.915

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Corphita

USA . 4,562 parts In-Stock

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Microchip USA

USA . 197 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430F67761IPZR by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments has once again delivered with this versatile microprocessor circuit. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers seeking reliable performance in a compact package. Trust in Texas Instruments to provide the solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits within the package.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and improving efficiency.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power sources, ensuring compatibility with various systems.

Package Shape: SQUARE

Optimizes space utilization on circuit boards.

Bit Size: 16

Provides a good balance between processing power and efficiency.

Power Supplies (V): 2/3.3

Allows for flexibility in power input options, accommodating different voltage requirements.

No. of Terminals: 100

Provides sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact design and efficient signal routing.

Minimum Supply Voltage: 1.8 V

Supports lower voltage applications for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

CPU Family: MSP430

Known for its low power consumption and high performance, ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

Designed to operate in harsh environments with extreme temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures reliable connections.

Terminal Position: QUAD

Facilitates easy soldering and secure mounting on the circuit board.

ROM Words: 262144

Offers ample memory storage capacity for program and data storage.

Maximum Seated Height: 1.6 mm

Contributes to a low-profile design and space-saving installation.

Width: 14 mm

Compact dimensions for efficient board layout.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes.

Length: 14 mm

Compact dimensions for efficient board layout.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications requiring extended temperature range.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrates multiple functions in a single chip, reducing component count and board space.

RAM Bytes: 16384

Provides sufficient memory for temporary data storage and processing.

Technology: CMOS

Known for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and reliable connections.

Maximum Supply Current: 11.75 mA

Efficient power consumption for extended battery life.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with most systems.

ROM Programmability: FLASH

Allows for easy reprogramming of memory contents.

Terminal Pitch: 0.5 mm

Allows for high-density mounting and fine-pitch applications.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and handling.

Speed: 25 rpm

Ensures fast processing and response time for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67761IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67761IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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