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MSP430F67751IPZR

Texas Instruments

MSP430F67751IPZR by Texas Instruments

MSP430F67751IPZR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a max supply voltage of 3.6 V and consumes up to 11.75 mA. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$5.443

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,333 parts In-Stock

1+ parts

$5.443

100+ parts

$4.437

1k+ parts

$2.958

10k+ parts

-

5,333

$5.443

$4.437

$2.958

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,885 parts In-Stock

1+ parts

$5.171

100+ parts

-

1k+ parts

-

10k+ parts

-

2,885

$5.171

-

-

-

Vyrian

USA . 5,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,738

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,046 parts In-Stock

1+ parts

$4.559

100+ parts

-

1k+ parts

-

10k+ parts

-

3,046

$4.559

-

-

-

Corphita

USA . 3,873 parts In-Stock

1+ parts

$4.899

100+ parts

-

1k+ parts

-

10k+ parts

-

3,873

$4.899

-

-

-

Parana Technologies

USA . 583 parts In-Stock

1+ parts

$14.705

100+ parts

-

1k+ parts

$15.145

10k+ parts

-

583

$14.705

-

$15.145

-

DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

$16.193

100+ parts

-

1k+ parts

-

10k+ parts

-

501

$16.193

-

-

-

ChromeModa Solutions

Germany . 6,487 parts In-Stock

1+ parts

$16.523

100+ parts

$13.549

1k+ parts

-

10k+ parts

-

6,487

$16.523

$13.549

-

-

IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$16.523

100+ parts

$15.697

1k+ parts

$14.871

10k+ parts

-

883

$16.523

$15.697

$14.871

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AZTECH Wire

Italy . 781 parts In-Stock

1+ parts

$19.950

100+ parts

-

1k+ parts

-

10k+ parts

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781

$19.950

-

-

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Microchip USA

USA . 2,885 parts In-Stock

1+ parts

$26.220

100+ parts

$26.050

1k+ parts

$25.970

10k+ parts

$25.890

2,885

$26.220

$26.050

$25.970

$25.890

Overview

Unlock a world of endless possibilities with the Texas Instruments MSP430F67751IPZR! This innovative microprocessor circuit offers unparalleled quality and reliability, backed by the trusted manufacturer Texas Instruments. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product delivers value, benefits, and advantages that will take your projects to the next level. Experience seamless performance, efficient power management, and cutting-edge technology with the MSP430F67751IPZR. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power input options for different applications.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space and layout design.

Bit Size: 16

Offers a good balance between processing power and complexity for various functions.

Power Supplies (V): 2/3.3

Supports multiple power supply options, making the IC versatile for different system requirements.

No. of Terminals: 100

Provides a sufficient number of connection points for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact and space-saving integration of the IC into electronic devices.

Minimum Supply Voltage: 1.8 V

Allows for operation in low power environments, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in demanding industrial operating conditions.

CPU Family: MSP430

Comes from a reputable and reliable family of microcontrollers, ensuring quality and performance.

Minimum Operating Temperature: -40 °C

Designed to withstand harsh cold environments, suitable for a wide range of applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67751IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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