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MSP430F6769IPZR

Texas Instruments

MSP430F6769IPZR by Texas Instruments

MSP430F6769IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words, 32768 RAM bytes, and max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,536 parts In-Stock

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5,536

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Digiode

USA . 2,198 parts In-Stock

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2,198

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Distributors (Availability)

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One Stop Electronics

USA . 1,033 parts In-Stock

1+ parts

$7.000

100+ parts

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1,033

$7.000

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AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$15.936

100+ parts

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680

$15.936

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Corohmni

South Africa . 790 parts In-Stock

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$39.221

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790

$39.221

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Parana Technologies

USA . 1,434 parts In-Stock

1+ parts

$67.876

100+ parts

$6,303.302

1k+ parts

$61.088

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1,434

$67.876

$6,303.302

$61.088

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DigiPath Technology Company

USA . 532 parts In-Stock

1+ parts

$74.740

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532

$74.740

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ChromeModa Solutions

Germany . 2,022 parts In-Stock

1+ parts

$76.265

100+ parts

$62.537

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2,022

$76.265

$62.537

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IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$76.265

100+ parts

$72.452

1k+ parts

$68.638

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749

$76.265

$72.452

$68.638

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Component Stockers USA

USA . 740 parts In-Stock

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$99.990

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740

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 15,106 parts In-Stock

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Corphita

USA . 4,284 parts In-Stock

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Microchip USA

USA . 424 parts In-Stock

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424

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Overview

Experience the next level of performance and reliability with the MSP430F6769IPZR by Texas Instruments. Designed with precision and expertise, this advanced microprocessor circuit offers unparalleled efficiency and versatility for a wide range of applications. From industrial automation to consumer electronics, the MSP430F6769IPZR delivers seamless integration, low power consumption, and high-speed processing capabilities. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and unlocks endless possibilities for innovation. Elevate your projects with the quality and value of the MSP430F6769IPZR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the IC, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications and provides flexibility in power supply options.

Package Shape: SQUARE

Optimizes space utilization on the PCB and allows for efficient layout design.

Bit Size: 16

Provides sufficient processing capability for a variety of tasks.

Power Supplies (V): 2/3.3

Compatible with a range of voltage inputs, enhancing versatility in different system configurations.

No. of Terminals: 100

Offers sufficient connectivity options for interfacing with other components in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates efficient heat dissipation and allows for high-density mounting on the PCB.

Minimum Supply Voltage: 1.8 V

Supports low-power operation and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

CPU Family: MSP430

Known for its low power consumption and high integration, making it suitable for battery-powered applications.

Minimum Operating Temperature: -40 °C

Allows for operation in harsh environments with extreme temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

Facilitates easy soldering and helps in accurate placement on the PCB.

ROM Words: 524288

Offers ample storage capacity for program memory, allowing for complex program execution.

Maximum Seated Height: 1.6 mm

Enables slim and compact design of electronic devices.

Width: 14 mm

Optimal size for fitting into various PCB layouts.

Maximum Clock Frequency: 25 MHz

Provides high-speed processing capabilities for quick data handling.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly process.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes for robust connections.

Length: 14 mm

Compact size for efficient space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring reliability in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers integrated peripheral functions for enhanced system capabilities.

RAM Bytes: 32768

Provides sufficient random-access memory for storing data during operation.

Technology: CMOS

Low power consumption and compatibility with a wide range of applications.

Terminal Form: GULL WING

Facilitates easy soldering and provides mechanical strength to the connections.

Maximum Supply Current: 11.75 mA

Efficient power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable voltage supply for consistent performance.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM for firmware upgrades and customization.

Bus Compatibility: I2C; SPI; UART

Supports various communication protocols for seamless integration with other devices.

Terminal Pitch: 0.5 mm

Fine pitch design for high-density mounting and space-saving on the PCB.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes and ensures reliability in humid environments.

Speed: 25 rpm

Provides fast processing speed for efficient operation of the IC.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6769IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6769IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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