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MSP430F6769IPEU

Texas Instruments

MSP430F6769IPEU by Texas Instruments

MSP430F6769IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. It features 32KB RAM and 524KB ROM, suitable for industrial applications requiring low power consumption and high processing speed. The IC supports I2C, SPI, and UART bus compatibility for versatile connectivity options.

Median Price

$11.842

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,757 parts In-Stock

1+ parts

$11.842

100+ parts

$10.344

1k+ parts

$7.134

10k+ parts

-

1,757

$11.842

$10.344

$7.134

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 237 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$11.250

-

-

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Vyrian

USA . 2,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,932

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,765 parts In-Stock

1+ parts

$10.658

100+ parts

-

1k+ parts

-

10k+ parts

-

1,765

$10.658

-

-

-

Corohmni

South Africa . 92 parts In-Stock

1+ parts

$12.761

100+ parts

-

1k+ parts

-

10k+ parts

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92

$12.761

-

-

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AZTECH Wire

Italy . 162 parts In-Stock

1+ parts

$15.500

100+ parts

-

1k+ parts

-

10k+ parts

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162

$15.500

-

-

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Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

$17.766

100+ parts

-

1k+ parts

$17.949

10k+ parts

-

1,361

$17.766

-

$17.949

-

DigiPath Technology Company

USA . 173 parts In-Stock

1+ parts

$19.563

100+ parts

$17.998

1k+ parts

-

10k+ parts

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173

$19.563

$17.998

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ChromeModa Solutions

Germany . 3,362 parts In-Stock

1+ parts

$19.962

100+ parts

$16.369

1k+ parts

-

10k+ parts

-

3,362

$19.962

$16.369

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IDEA Electronic Components Group

UK . 460 parts In-Stock

1+ parts

$19.962

100+ parts

$18.964

1k+ parts

$17.966

10k+ parts

-

460

$19.962

$18.964

$17.966

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$35.851

100+ parts

$32.624

1k+ parts

$29.398

10k+ parts

-

2,000

$35.851

$32.624

$29.398

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Microchip USA

USA . 1,194 parts In-Stock

1+ parts

$37.320

100+ parts

$36.790

1k+ parts

$36.520

10k+ parts

$36.260

1,194

$37.320

$36.790

$36.520

$36.260

Component Stockers USA

USA . 675 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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675

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6769IPEU, a cutting-edge microprocessor circuit designed to push boundaries and drive progress. With its advanced technology and high-quality design, this versatile IC offers endless possibilities for a wide range of applications. From IoT devices to industrial automation, the MSP430F6769IPEU delivers unparalleled performance and reliability, making it the perfect choice for engineers and developers seeking top-notch solutions. Embrace the future of technology with Texas Instruments and experience the difference in quality, value, and efficiency that sets this product apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making the product reliable in various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the component on a PCB, enabling space-saving in electronic designs.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, the product can be used in a wide range of applications without the risk of voltage damage.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures easy integration into standardized PCB layouts and offers a neat appearance for the overall design.

Bit Size: 16

A 16-bit architecture provides improved processing capabilities and precision, making this product suitable for tasks requiring high computational accuracy.

Power Supplies (V): 2/3.3

The availability of multiple power supply options allows flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 128

Having a high number of terminals enables connectivity to a wide range of external devices, expanding the product's versatility in use.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and space-saving form factor for the product, ideal for applications where board space is limited.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows the product to operate efficiently in low-power or energy-efficient designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

The MSP430 family is known for its low-power consumption and high performance, making this product a reliable choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the product can withstand harsh operating conditions, making it suitable for both indoor and outdoor use.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and conductivity, ensuring reliable connections and long-term performance of the product.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the product to interface with analog sensors and signals, expanding its application capabilities.

Terminal Position: QUAD

The quad terminal position offers efficient soldering and secure connections, enhancing the product's reliability in demanding working environments.

ROM Words: 524288

A large ROM capacity allows for storing extensive program codes and data, making the product suitable for complex computing tasks and applications.

Maximum Seated Height: 1.6 mm

The low seated height of the package ensures minimal space consumption on the PCB, contributing to a compact and efficient overall design.

RAM Words: 32

Although limited in capacity, the RAM words provide temporary storage for computational processes, enhancing the product's processing capabilities.

Width: 14 mm

The compact width of the product allows for easy integration into tight spaces or designs with specific size constraints.

Maximum Clock Frequency: 25 MHz

The high clock frequency enables fast processing speeds, ensuring efficient operation and response times in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the product can undergo fast and reliable soldering processes, reducing manufacturing time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for effective soldering without damaging the product, ensuring robust connections and durability.

Length: 20 mm

The moderate length of the product facilitates easy handling and installation on the PCB, contributing to a streamlined manufacturing process.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product meets stringent temperature requirements and reliability standards for robust performance in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product can perform complex computing tasks and interface with various peripherals, offering versatility in system integration.

RAM Bytes: 32768

With a large RAM capacity, the product can efficiently handle data processing and temporary storage requirements for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product efficient and suitable for portable or battery-powered devices.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliability in the product's performance.

Maximum Supply Current: 11.75 mA

The low supply current requirement contributes to energy efficiency and extended battery life in applications where power consumption is a key consideration.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance of the product within the specified operating range, offering reliability in various environments.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and customization of the product's firmware and software, ensuring adaptability to changing requirements.

Bus Compatibility: I2C; SPI; UART

With compatibility for multiple communication protocols, the product can easily interface with a variety of devices and systems, enabling seamless data exchange.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on the PCB, enabling compact designs and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the sensitivity of the product to moisture during storage and handling, ensuring proper precautions are taken to prevent damage.

Speed: 25 rpm

With a speed rating of 25 rpm, the product can efficiently process tasks and data at a consistent and reliable pace, meeting performance requirements.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6769IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6769IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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