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MSP430F67691AIPZR

Texas Instruments

MSP430F67691AIPZR by Texas Instruments

MSP430F67691AIPZR by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels, 32-word RAM, and 524288 ROM words. Ideal for industrial applications, it offers BOR, RTC, and UART connectivity with a max clock frequency of 0.032768 MHz. Operating temperature ranges from -40 to 85 °C.

Median Price

$9.054

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,115 parts In-Stock

1+ parts

$9.054

100+ parts

$7.908

1k+ parts

$5.454

10k+ parts

-

1,115

$9.054

$7.908

$5.454

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,126 parts In-Stock

1+ parts

$8.601

100+ parts

-

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3,126

$8.601

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Vyrian

USA . 6,733 parts In-Stock

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6,733

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Distributors (Availability)

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Corphita

USA . 2,717 parts In-Stock

1+ parts

$8.149

100+ parts

-

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2,717

$8.149

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AZTECH Wire

Italy . 1,051 parts In-Stock

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$15.200

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1,051

$15.200

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Advanced Electronics

New Zealand . 1,518 parts In-Stock

1+ parts

$20.685

100+ parts

$20.478

1k+ parts

$19.651

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1,518

$20.685

$20.478

$19.651

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Corohmni

South Africa . 2,370 parts In-Stock

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$37.139

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2,370

$37.139

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Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

$71.199

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2,108

$71.199

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DigiPath Technology Company

USA . 1,943 parts In-Stock

1+ parts

$78.399

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1,943

$78.399

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ChromeModa Solutions

Germany . 5,044 parts In-Stock

1+ parts

$79.999

100+ parts

$65.599

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5,044

$79.999

$65.599

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IDEA Electronic Components Group

UK . 1,883 parts In-Stock

1+ parts

$79.999

100+ parts

$75.999

1k+ parts

$71.999

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1,883

$79.999

$75.999

$71.999

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Perfect Parts

USA . 3,360 parts In-Stock

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3,360

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Overview

Elevate your electronics projects with the MSP430F67691AIPZR by Texas Instruments, a high-quality microprocessor circuit that offers unparalleled performance and reliability. With its advanced technology and extensive connectivity options, this product is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. Experience the benefits of seamless integration, efficient power management, and versatile peripherals, all in a compact and durable package. Trust in Texas Instruments' reputation for excellence and choose the MSP430F67691AIPZR for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to temperature variations, making the product reliable for different operating conditions.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input, accommodating a range of voltage levels for proper operation.

CPU Family: MSP430

The MSP430 CPU family offers efficient and low power consumption processing, enhancing overall performance and extending battery life.

ROM Words: 524288

The large ROM size allows for storing a significant amount of program data, enabling complex applications to run smoothly on the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The presence of a microprocessor circuit enhances the product's functionality by enabling various input/output operations and communication protocols.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, facilitating ease of use.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options allow for versatile communication interfaces, enabling seamless integration with external devices and networks.

Speed: 25 rpm

The moderate speed rating of 25 rpm suits various industrial applications, providing reliable performance in tasks requiring precise timing and control.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67691AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67691AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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