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MSP430F6768AIPZ

Texas Instruments

MSP430F6768AIPZ by Texas Instruments

MSP430F6768AIPZ by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels, 16384 RAM bytes, and 524288 ROM words. Ideal for industrial applications due to -40 to 85 °C operating temperature range and peripherals like BOR, RTC, and WDT. Offers I2C, SPI, UART connectivity options for versatile integration.

Median Price

$15.366

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,806 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

2,806

$12.072

$10.544

$7.272

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$18.660

100+ parts

$10.810

1k+ parts

$10.600

10k+ parts

-

4

$18.660

$10.810

$10.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,351 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

10k+ parts

-

4,351

$11.468

-

-

-

Vyrian

USA . 7,815 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,815

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,010 parts In-Stock

1+ parts

$10.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

$10.260

-

-

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Corohmni

South Africa . 5,097 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

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5,097

$10.748

-

-

-

Corphita

USA . 1,974 parts In-Stock

1+ parts

$10.865

100+ parts

-

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-

10k+ parts

-

1,974

$10.865

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-

-

Microchip USA

USA . 2,406 parts In-Stock

1+ parts

$33.520

100+ parts

$33.040

1k+ parts

$32.800

10k+ parts

$32.560

2,406

$33.520

$33.040

$32.800

$32.560

Parana Technologies

USA . 1,974 parts In-Stock

1+ parts

$57.360

100+ parts

-

1k+ parts

-

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1,974

$57.360

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-

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$63.161

100+ parts

-

1k+ parts

-

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2,004

$63.161

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-

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ChromeModa Solutions

Germany . 3,396 parts In-Stock

1+ parts

$64.450

100+ parts

$52.849

1k+ parts

-

10k+ parts

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3,396

$64.450

$52.849

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IDEA Electronic Components Group

UK . 2,258 parts In-Stock

1+ parts

$64.450

100+ parts

$61.228

1k+ parts

$58.005

10k+ parts

-

2,258

$64.450

$61.228

$58.005

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Component Stockers USA

USA . 776 parts In-Stock

1+ parts

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100+ parts

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776

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Overview

Experience the power of innovation with the Texas Instruments MSP430F6768AIPZ. This advanced microprocessor circuit offers unparalleled quality and reliability, making it the top choice for a wide range of applications. From industrial automation to consumer electronics, this versatile IC delivers exceptional performance and efficiency. With its cutting-edge technology and comprehensive peripherals, the MSP430F6768AIPZ provides unmatched value and benefits to customers seeking top-notch solutions for their projects. Trust Texas Instruments for your semiconductor needs and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a high supply voltage tolerance for compatibility with various power sources.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards.

Bit Size: 16

Provides a good balance between processing power and complexity for a wide range of applications.

No. of Terminals: 100

Offers ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style makes the product suitable for compact designs and precise assembly.

Minimum Supply Voltage: 2.4 V

Allows the product to operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

Can perform reliably even in high-temperature environments.

CPU Family: MSP430

Belongs to a reputable and reliable CPU family for consistent performance.

Minimum Operating Temperature: -40 °C

Can function in extremely low-temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity for long-lasting performance.

ADC Channels: YES

Allows for analog-to-digital conversion for sensing and data acquisition.

DMA Channels: YES

Enables direct memory access for efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position offers stability and ease of soldering during assembly.

ROM Words: 524288

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

RAM Words: 16

Sufficient random access memory for temporary data storage and processing.

Width: 14 mm

Compact width for fitting into narrow spaces.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Rich set of peripherals for enhanced functionality and versatility.

Maximum Clock Frequency: 0.032768 MHz

Offers high clock frequency for fast and efficient processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for proper soldering.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes.

Length: 14 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides advanced processing capabilities.

RAM Bytes: 16384

Large RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple ADC channels for accurate analog data conversion.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options for communication with external devices.

ROM Programmability: FLASH

Flash ROM allows for easy and flexible programming of memory.

Bus Compatibility: I2C; SPI; UART

Compatible with popular bus protocols for seamless integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and compact designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for safe handling and storage.

Speed: 25 rpm

Operates at a reliable speed for efficient processing tasks.

On Chip Program ROM Width: 8

On-chip ROM storage width for storing program instructions.

No. of I/O Lines: 62

Abundant I/O lines for versatile input and output connections.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6768AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6768AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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