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MSP430F6767IPZR

Texas Instruments

MSP430F6767IPZR by Texas Instruments

MSP430F6767IPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words, 32768 RAM bytes, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,485 parts In-Stock

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Digiode

USA . 3,335 parts In-Stock

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3,335

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Distributors (Availability)

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AZTECH Wire

Italy . 711 parts In-Stock

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$7.144

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711

$7.144

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Corohmni

South Africa . 561 parts In-Stock

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$25.865

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One Stop Electronics

USA . 714 parts In-Stock

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$31.000

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714

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Parana Technologies

USA . 1,966 parts In-Stock

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$67.082

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DigiPath Technology Company

USA . 1,403 parts In-Stock

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$73.866

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$67.956

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$73.866

$67.956

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ChromeModa Solutions

Germany . 4,260 parts In-Stock

1+ parts

$75.373

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$61.806

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$75.373

$61.806

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IDEA Electronic Components Group

UK . 35 parts In-Stock

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$75.373

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$71.604

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$67.836

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35

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$67.836

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Corphita

USA . 3,714 parts In-Stock

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Microchip USA

USA . 307 parts In-Stock

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Overview

Discover the power of the Texas Instruments MSP430F6767IPZR, a top-of-the-line microprocessor circuit designed for a wide range of applications. With cutting-edge technology and superior quality, this product offers unmatched performance and reliability. Whether you're looking to optimize your industrial automation systems or enhance your portable electronics, this innovative solution provides the speed, efficiency, and flexibility you need. Experience the difference with Texas Instruments and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, making it suitable for various applications and environments.

Surface Mount: YES

Allows for easy and efficient mounting on a PCB, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, increasing compatibility with different systems.

Package Shape: SQUARE

Facilitates a compact design and efficient use of space on the PCB.

Bit Size: 16

Offers a good balance between performance and power consumption for various applications.

Power Supplies (V): 2/3.3

Flexible voltage options for compatibility with different power sources and requirements.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a low profile and compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Allows operation at low supply voltages, making the IC suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

CPU Family: MSP430

The MSP430 family is known for low power consumption and high performance, making it a good choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Ensures operation in extreme cold conditions, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: QUAD

Provides stable mechanical support for the IC during installation and operation.

ROM Words: 262144

Offers ample non-volatile memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Contributes to a low profile design, suitable for space-constrained applications.

Width: 14 mm

Compact width allows for efficient placement on the PCB.

Maximum Clock Frequency: 25 MHz

Provides high-speed processing capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, maintaining the integrity of the connections.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during the soldering process.

Length: 14 mm

Compact length contributes to space-saving design.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding temperature and environmental conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrates various peripheral functions, reducing the need for additional components.

RAM Bytes: 32768

Offers sufficient memory for data storage and manipulation during operation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Facilitates easy soldering and mechanical stability during installation.

Maximum Supply Current: 11.75 mA

Efficient power consumption for energy-conscious applications.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with a wide range of systems.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of firmware.

Bus Compatibility: I2C; SPI; UART

Supports various communication interfaces, enabling easy integration into different systems.

Terminal Pitch: 0.5 mm

Fine pitch allows for efficient routing of signal traces on the PCB.

Moisture Sensitivity Level (MSL): 3

Designed to withstand mild levels of moisture exposure during handling and operation.

Speed: 25 rpm

Provides fast processing capabilities for real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6767IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6767IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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