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MSP430F6765IPEUR

Texas Instruments

MSP430F6765IPEUR by Texas Instruments

MSP430F6765IPEUR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words, 16384 RAM bytes, and a max clock frequency of 25 MHz. It operates in industrial temperatures (-40 to 85 °C) and is suitable for applications requiring low power consumption and high processing speeds.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,276 parts In-Stock

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3,276

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Digiode

USA . 619 parts In-Stock

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619

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Distributors (Availability)

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AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$5.658

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388

$5.658

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One Stop Electronics

USA . 1,358 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 991 parts In-Stock

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$58.067

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991

$58.067

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ChromeModa Solutions

Germany . 1,954 parts In-Stock

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$65.244

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$53.500

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1,954

$65.244

$53.500

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

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$65.244

100+ parts

$61.982

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$58.720

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1,833

$65.244

$61.982

$58.720

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Corohmni

South Africa . 280 parts In-Stock

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$70.108

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280

$70.108

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Corphita

USA . 2,562 parts In-Stock

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Microchip USA

USA . 252 parts In-Stock

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DigiPath Technology Company

USA . 5 parts In-Stock

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$58.824

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5

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$58.824

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Overview

Discover the cutting-edge technology of the Texas Instruments MSP430F6765IPEUR, a high-quality microprocessor circuit that brings unmatched performance and reliability to your projects. With a wide range of applications in various industries, this product offers incredible value by providing seamless integration, low power consumption, and exceptional functionality. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, this MSP430 series CPU will exceed your expectations and help you achieve your goals with ease. Choose Texas Instruments for innovation, quality, and unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage of 3.6V enables flexibility in power supply options for the device.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of PCB space and easy integration into electronic designs.

Bit Size: 16

16-bit architecture provides improved performance and processing capabilities compared to lower bit-size options.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) allows for compatibility with various power sources and voltage requirements.

No. of Terminals: 128

Having 128 terminals ensures connectivity to various external components and peripherals for enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile design with fine pitch enhances PCB layout flexibility and facilitates compact electronic designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage of 1.8V allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in a wide range of environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates efficient power management features and performance optimization for embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40°C to 85°C enables operation in extreme temperature environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and reliability for long-term use.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and secure connection to the PCB, enhancing overall product durability.

ROM Words: 131072

Large ROM capacity of 131072 words offers ample storage for program instructions and data, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm enables slim and compact device designs, suitable for space-constrained applications.

Width: 14 mm

Narrow width of 14mm facilitates efficient PCB layout and integration of the IC into various electronic systems.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz allows for fast processing speed and performance in demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a max reflow time of 30 seconds, the IC can withstand the reflow soldering process efficiently during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust solder connections and reliability in the assembly process.

Length: 20 mm

Compact length of 20mm contributes to space-saving designs and ease of integration in various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates reliable performance and durability in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit as a peripheral IC type provides advanced processing capabilities and versatile peripheral support for the device.

RAM Bytes: 16384

Offering 16384 bytes of RAM provides sufficient memory for data storage and manipulation, supporting multitasking and complex operations.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable operation, making the IC suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mount soldering and enhances mechanical strength for secure PCB attachment.

Maximum Supply Current: 11.75 mA

Low maximum supply current of 11.75mA contributes to energy-efficient operation and reduced power consumption.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable and consistent power delivery for optimal performance of the IC.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating of firmware and configuration settings, enhancing flexibility and ease of maintenance.

Bus Compatibility: I2C; SPI; UART

Support for various bus interfaces such as I2C, SPI, and UART allows for seamless communication with external devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and compact PCB design, saving space and improving overall system efficiency.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the IC's resistance to moisture absorption, ensuring reliability in humid environments.

Speed: 25 rpm

Operating at a speed of 25 rpm, the IC can process data and instructions efficiently, contributing to overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6765IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6765IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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