Loading...

MSP430F6765IPEU

Texas Instruments

MSP430F6765IPEU by Texas Instruments

MSP430F6765IPEU by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it is ideal for industrial applications requiring a max supply voltage of 3.6 V. With I2C, SPI, and UART bus compatibility, this low-profile IC offers versatile performance in compact designs.

Median Price

$7.780

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$7.780

100+ parts

$6.342

1k+ parts

$4.228

10k+ parts

-

758

$7.780

$6.342

$4.228

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,678 parts In-Stock

1+ parts

$7.391

100+ parts

-

1k+ parts

-

10k+ parts

-

2,678

$7.391

-

-

-

Vyrian

USA . 1,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,906

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,216 parts In-Stock

1+ parts

$7.002

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

$7.002

-

-

-

Corohmni

South Africa . 2,037 parts In-Stock

1+ parts

$8.128

100+ parts

-

1k+ parts

-

10k+ parts

-

2,037

$8.128

-

-

-

AZTECH Wire

Italy . 42 parts In-Stock

1+ parts

$20.360

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$20.360

-

-

-

Microchip USA

USA . 1,642 parts In-Stock

1+ parts

$24.510

100+ parts

$24.160

1k+ parts

$23.990

10k+ parts

$23.810

1,642

$24.510

$24.160

$23.990

$23.810

Parana Technologies

USA . 457 parts In-Stock

1+ parts

$39.900

100+ parts

-

1k+ parts

-

10k+ parts

-

457

$39.900

-

-

-

DigiPath Technology Company

USA . 1,863 parts In-Stock

1+ parts

$43.935

100+ parts

$40.421

1k+ parts

-

10k+ parts

-

1,863

$43.935

$40.421

-

-

ChromeModa Solutions

Germany . 1,441 parts In-Stock

1+ parts

$44.832

100+ parts

$36.762

1k+ parts

-

10k+ parts

-

1,441

$44.832

$36.762

-

-

IDEA Electronic Components Group

UK . 489 parts In-Stock

1+ parts

$44.832

100+ parts

$42.590

1k+ parts

$40.349

10k+ parts

-

489

$44.832

$42.590

$40.349

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F6765IPEU microcontroller. Designed for a wide range of applications in the industrial sector, this high-quality product boasts top-notch performance and reliability. With advanced features and a superior design, this microcontroller offers unmatched value to customers looking to streamline their operations and enhance efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and surpasses your expectations. Elevate your projects with the MSP430F6765IPEU and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount feature allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power options.

Package Shape: RECTANGULAR

Rectangular package shape saves space and allows for efficient PCB layout.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities.

Power Supplies (V): 2/3.3

Support for multiple power supply options increases compatibility with different systems.

No. of Terminals: 128

High number of terminals allows for versatile connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensures space-saving and efficient design.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage ensures power efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environments.

CPU Family: MSP430

Part of the MSP430 CPU family known for energy-efficient performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Support for ADC channels enables analog-to-digital conversion for sensor interfacing.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connections on the PCB.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height: 1.6 mm

Low seated height saves space and allows for compact design.

RAM Words: 16

Sufficient RAM capacity for temporary data storage and processing.

Width: 14 mm

Compact width allows for efficient PCB layout and space-saving design.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Resilience to peak reflow temperature for a specified amount of time ensures reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust manufacturing processes.

Length: 20 mm

Moderate length for balance between compact design and functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit as peripheral IC type ensures efficient data processing capabilities.

RAM Bytes: 16384

Large RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections on the PCB.

Maximum Supply Current: 11.75 mA

Low maximum supply current for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the program data.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols enables versatile communication interfaces.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense PCB layout and space-saving design.

Moisture Sensitivity Level (MSL): 3

MSL level ensures moisture resistance during manufacturing and operation.

Speed: 25 rpm

High processing speed for quick data processing and response times.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6765IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6765IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20