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MSP430F6749IPEUR

Texas Instruments

MSP430F6749IPEUR by Texas Instruments

MSP430F6749IPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words, 32768 RAM bytes, and max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor. Compatible with I2C, SPI, and UART bus interfaces for versatile connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,162 parts In-Stock

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Vyrian

USA . 1,907 parts In-Stock

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1,907

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Distributors (Availability)

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AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$9.958

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876

$9.958

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One Stop Electronics

USA . 198 parts In-Stock

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$21.000

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198

$21.000

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Parana Technologies

USA . 122 parts In-Stock

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$54.842

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122

$54.842

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Corohmni

South Africa . 70 parts In-Stock

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$58.838

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70

$58.838

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DigiPath Technology Company

USA . 1,987 parts In-Stock

1+ parts

$60.388

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$55.557

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1,987

$60.388

$55.557

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ChromeModa Solutions

Germany . 2,976 parts In-Stock

1+ parts

$61.620

100+ parts

$50.528

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2,976

$61.620

$50.528

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IDEA Electronic Components Group

UK . 1,441 parts In-Stock

1+ parts

$61.620

100+ parts

$58.539

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$55.458

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1,441

$61.620

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$55.458

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Corphita

USA . 3,920 parts In-Stock

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Microchip USA

USA . 215 parts In-Stock

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Overview

Unlock the potential of your embedded system with the Texas Instruments MSP430F6749IPEUR microprocessor circuit. With its cutting-edge technology and reliable performance, this device offers unparalleled value to customers in various industries. From industrial automation to consumer electronics, the MSP430F6749IPEUR delivers high-speed processing and efficient power management, ensuring optimal functionality for your applications. Trust Texas Instruments for quality and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits inside.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Compact and space-efficient design for easy integration into electronic devices.

Bit Size: 16

Offers sufficient processing power for a variety of tasks.

Power Supplies (V): 2/3.3

Supports multiple supply voltages, enabling compatibility with various systems.

No. of Terminals: 128

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances thermal performance and allows for high-density PCB integration.

Minimum Supply Voltage: 1.8 V

Can operate at a low supply voltage, saving power and reducing heat dissipation.

Maximum Operating Temperature: 85 °C

Can function reliably in a wide range of operating environments.

CPU Family: MSP430

Belongs to a proven and reliable microcontroller family known for its low power consumption.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Improves electrical conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Facilitates easy soldering and provides mechanical stability on the PCB.

ROM Words: 524288

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact electronic devices.

Width: 14 mm

Compact size for easy integration into electronic designs.

Maximum Clock Frequency: 25 MHz

High clock speed for rapid data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient solder reflow processes during assembly.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes without damage.

Length: 20 mm

Compact length for easy PCB layout and design.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where robustness and reliability are critical.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes integrated peripheral circuits for enhanced functionality and connectivity.

RAM Bytes: 32768

Sufficient random access memory for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: GULL WING

Facilitates easy soldering and mechanical stability during assembly.

Maximum Supply Current: 11.75 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with most electronic systems.

ROM Programmability: FLASH

Allows for easy reprogramming of ROM data for flexibility in applications.

Bus Compatibility: I2C; SPI; UART

Supports multiple communication interfaces for versatile connectivity options.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layouts and space-saving designs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate exposure to moisture.

Speed: 25 rpm

Fast data processing speed for efficient system operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6749IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6749IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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