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MSP430F67491AIPEU

Texas Instruments

MSP430F67491AIPEU by Texas Instruments

MSP430F67491AIPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,766 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

1,766

$12.976

$11.335

$7.817

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,868 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

-

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-

2,868

$12.327

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Chip Stock

USA . 4,850 parts In-Stock

1+ parts

-

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4,850

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Vyrian

USA . 2,068 parts In-Stock

1+ parts

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2,068

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,478 parts In-Stock

1+ parts

$11.030

100+ parts

-

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-

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1,478

$11.030

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Corphita

USA . 4,890 parts In-Stock

1+ parts

$11.678

100+ parts

-

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4,890

$11.678

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AZTECH Wire

Italy . 59 parts In-Stock

1+ parts

$21.730

100+ parts

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59

$21.730

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-

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Corohmni

South Africa . 2,353 parts In-Stock

1+ parts

$37.333

100+ parts

-

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2,353

$37.333

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Parana Technologies

USA . 2,361 parts In-Stock

1+ parts

$70.427

100+ parts

-

1k+ parts

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10k+ parts

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2,361

$70.427

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ChromeModa Solutions

Germany . 3,262 parts In-Stock

1+ parts

$79.131

100+ parts

$64.887

1k+ parts

-

10k+ parts

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3,262

$79.131

$64.887

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

1+ parts

$79.131

100+ parts

$75.174

1k+ parts

$71.218

10k+ parts

-

2,255

$79.131

$75.174

$71.218

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DigiPath Technology Company

USA . 1,933 parts In-Stock

1+ parts

-

100+ parts

$71.345

1k+ parts

-

10k+ parts

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1,933

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$71.345

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Overview

Unleash the power of innovation with the MSP430F67491AIPEU by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, making it ideal for a wide range of applications. With advanced features like multiple ADC channels, DMA channels, and a variety of peripherals, this product provides exceptional value and performance. Whether you're designing industrial automation systems or consumer electronics, the MSP430F67491AIPEU delivers the speed, connectivity, and flexibility you need to bring your ideas to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, ensuring reliable performance in various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with different voltage requirements in electronic systems.

Bit Size: 16

16-bit processing capability enables handling of complex calculations and tasks efficiently.

ADC Channels: YES

Analog to digital converter channels enable the IC to convert analog signals into digital data for processing, expanding its functionality.

DMA Channels: YES

Direct memory access channels allow for efficient data transfers between memory and peripherals, improving overall system performance.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program instructions and data, enhancing the IC's versatility.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC can handle complex computations and tasks efficiently, making it suitable for a wide range of applications.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options such as I2C, IRDA, SPI, and UART enable easy interfacing with other devices and systems, enhancing the IC's compatibility and flexibility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67491AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67491AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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