Loading...

MSP430F67481IPZ

Texas Instruments

MSP430F67481IPZ by Texas Instruments

MSP430F67481IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART buses for industrial applications requiring low power consumption. The package style is flatpack with a low profile and fine pitch design.

Median Price

$10.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$10.260

100+ parts

$8.962

1k+ parts

$6.181

10k+ parts

-

740

$10.260

$8.962

$6.181

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 480 parts In-Stock

1+ parts

$9.747

100+ parts

-

1k+ parts

-

10k+ parts

-

480

$9.747

-

-

-

Vyrian

USA . 3,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,453

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$9.030

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$9.030

-

-

-

Corphita

USA . 3,720 parts In-Stock

1+ parts

$9.234

100+ parts

-

1k+ parts

-

10k+ parts

-

3,720

$9.234

-

-

-

Corohmni

South Africa . 38 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$10.748

-

-

-

Microchip USA

USA . 2,635 parts In-Stock

1+ parts

$28.490

100+ parts

$28.090

1k+ parts

$27.880

10k+ parts

$27.680

2,635

$28.490

$28.090

$27.880

$27.680

Parana Technologies

USA . 204 parts In-Stock

1+ parts

$74.402

100+ parts

$6,909.375

1k+ parts

$66.962

10k+ parts

-

204

$74.402

$6,909.375

$66.962

-

DigiPath Technology Company

USA . 2,302 parts In-Stock

1+ parts

$81.926

100+ parts

$75.372

1k+ parts

-

10k+ parts

-

2,302

$81.926

$75.372

-

-

ChromeModa Solutions

Germany . 4,641 parts In-Stock

1+ parts

$83.598

100+ parts

$68.550

1k+ parts

-

10k+ parts

-

4,641

$83.598

$68.550

-

-

IDEA Electronic Components Group

UK . 836 parts In-Stock

1+ parts

$83.598

100+ parts

$79.418

1k+ parts

$75.238

10k+ parts

-

836

$83.598

$79.418

$75.238

-

Overview

Unlock the power of innovation with the MSP430F67481IPZ by Texas Instruments, a cutting-edge microprocessor circuit designed for a wide range of applications. This high-quality product boasts a robust package body material and advanced technology, making it ideal for industrial use. With features such as flash ROM programmability, 16-bit processing, and multiple ADC channels, this microprocessor provides unparalleled performance and versatility. Trust in Texas Instruments for reliable solutions that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation and integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a wide range of acceptable input voltages for versatility in different applications.

Package Shape: SQUARE

Optimizes space efficiency on circuit boards and reduces wasted area.

Bit Size: 16

Enables processing of data in 16-bit chunks, improving efficiency and speed.

Power Supplies (V): 2/3.3

Offers flexibility in power requirements to meet different system demands.

No. of Terminals: 100

Provides ample connection points for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances space-saving design and easy installation in compact devices.

Minimum Supply Voltage: 1.8 V

Ensures reliable operation even at lower power levels.

Maximum Operating Temperature: 85 °C

Allows for operation in high-temperature environments without performance degradation.

CPU Family: MSP430

Indicates a high-performance and reliable microcontroller for various applications.

Minimum Operating Temperature: -40 °C

Ensures operation in extreme cold conditions without malfunctioning.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and long-term reliability for the terminals.

ADC Channels: YES

Enables analog-to-digital conversion for accurate sensor readings and data acquisition.

Terminal Position: QUAD

Facilitates easy connection to other components in a compact footprint.

ROM Words: 524288

Offers ample storage capacity for program and data storage in the product.

Maximum Seated Height: 1.6 mm

Ensures a low-profile design for thin and compact devices.

RAM Words: 16

Provides temporary storage for data processing in the product.

Width: 14 mm

Contributes to the compact size of the product for space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67481IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67481IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20