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MSP430F67481AIPEUR

Texas Instruments

MSP430F67481AIPEUR by Texas Instruments

MSP430F67481AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, 524288 ROM words, and 6 ADC channels. Ideal for industrial applications requiring low power consumption and high performance due to its CMOS technology, 3.3V supply voltage, and multiple connectivity options like I2C, SPI, UART.

Median Price

$9.869

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,504 parts In-Stock

1+ parts

$9.869

100+ parts

$8.620

1k+ parts

$5.945

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-

2,504

$9.869

$8.620

$5.945

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,439 parts In-Stock

1+ parts

$9.376

100+ parts

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4,439

$9.376

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Chip Stock

USA . 3,700 parts In-Stock

1+ parts

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3,700

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Vyrian

USA . 2,640 parts In-Stock

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2,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,507 parts In-Stock

1+ parts

$8.882

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-

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4,507

$8.882

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Corohmni

South Africa . 1,081 parts In-Stock

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$15.813

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1,081

$15.813

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AZTECH Wire

Italy . 894 parts In-Stock

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$19.910

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894

$19.910

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Microchip USA

USA . 2,677 parts In-Stock

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$28.157

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2,677

$28.157

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Parana Technologies

USA . 1,029 parts In-Stock

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$65.810

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1,029

$65.810

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ChromeModa Solutions

Germany . 3,015 parts In-Stock

1+ parts

$73.944

100+ parts

$60.634

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3,015

$73.944

$60.634

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$73.944

100+ parts

$70.247

1k+ parts

$66.550

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2,030

$73.944

$70.247

$66.550

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DigiPath Technology Company

USA . 620 parts In-Stock

1+ parts

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100+ parts

$66.668

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620

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$66.668

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Overview

Experience the cutting-edge technology of Texas Instruments with the MSP430F67481AIPEUR, a versatile microprocessor circuit perfect for a wide range of applications. With its innovative design and top-notch quality, this product offers customers unparalleled value by providing advanced features such as analog to digital converters, PWM channels, and multiple connectivity options. Whether you're working on IoT devices, industrial automation, or consumer electronics, this microprocessor will exceed your expectations with its reliability and performance. Upgrade your projects today with the MSP430F67481AIPEUR and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature makes installation and assembly easier and more efficient, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a wider range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, maximizing space efficiency in electronic devices.

Bit Size: 16

The 16-bit size provides enhanced processing capabilities, enabling higher performance and faster execution of commands.

ADC Channels: YES

The presence of Analog to Digital Convertor (ADC) channels allows for accurate conversion of analog signals to digital data, expanding the functionality of the product.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency by allowing data to be transferred between memory locations without involving the CPU, optimizing system performance.

ROM Words: 524288

The large ROM capacity of 524288 words offers ample space for program storage, accommodating complex algorithms and applications.

Maximum Clock Frequency: 0.032768 MHz

The high maximum clock frequency of 0.032768 MHz supports fast and reliable operation, ensuring smooth execution of tasks.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The presence of various peripheral ICs, such as BOR, comparator, RTC, timer, and WDT, enhances the product's versatility and functionality for diverse applications.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures stable and consistent power supply, contributing to reliable performance and system operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67481AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67481AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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