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MSP430F6746IPZ

Texas Instruments

MSP430F6746IPZ by Texas Instruments

MSP430F6746IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. Operating at a max clock frequency of 25 MHz, it is suitable for industrial applications requiring a CPU family of MSP430 and peripheral IC type of MICROPROCESSOR CIRCUIT. With a package style of FLATPACK, LOW PROFILE, FINE PITCH, this device supports I2C, SPI, and UART bus compatibility.

Median Price

$8.068

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$8.068

100+ parts

$6.578

1k+ parts

$4.385

10k+ parts

-

740

$8.068

$6.578

$4.385

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,215 parts In-Stock

1+ parts

$7.665

100+ parts

-

1k+ parts

-

10k+ parts

-

3,215

$7.665

-

-

-

Vyrian

USA . 8,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,732

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,532 parts In-Stock

1+ parts

$7.261

100+ parts

-

1k+ parts

-

10k+ parts

-

3,532

$7.261

-

-

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$8.910

100+ parts

-

1k+ parts

-

10k+ parts

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644

$8.910

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-

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Corohmni

South Africa . 56 parts In-Stock

1+ parts

$10.403

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$10.403

-

-

-

Microchip USA

USA . 1,714 parts In-Stock

1+ parts

$25.500

100+ parts

$25.130

1k+ parts

$24.950

10k+ parts

$24.770

1,714

$25.500

$25.130

$24.950

$24.770

Parana Technologies

USA . 1,844 parts In-Stock

1+ parts

$76.482

100+ parts

-

1k+ parts

-

10k+ parts

-

1,844

$76.482

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DigiPath Technology Company

USA . 153 parts In-Stock

1+ parts

$84.216

100+ parts

$77.479

1k+ parts

-

10k+ parts

-

153

$84.216

$77.479

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ChromeModa Solutions

Germany . 2,486 parts In-Stock

1+ parts

$85.935

100+ parts

$70.467

1k+ parts

-

10k+ parts

-

2,486

$85.935

$70.467

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IDEA Electronic Components Group

UK . 1,699 parts In-Stock

1+ parts

$85.935

100+ parts

$81.638

1k+ parts

$77.342

10k+ parts

-

1,699

$85.935

$81.638

$77.342

-

Futuretech Components

Singapore . 828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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828

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Kepictronics

USA . 161 parts In-Stock

1+ parts

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161

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Overview

Discover the innovative MSP430F6746IPZ by Texas Instruments, setting new standards in performance and reliability. Designed with cutting-edge technology, this microprocessor circuit offers endless possibilities for various applications. With a focus on quality and precision, Texas Instruments delivers unmatched value to customers seeking a powerful solution for their projects. Whether you're designing IoT devices or industrial control systems, the MSP430F6746IPZ provides seamless integration and exceptional performance. Trust in Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, making it versatile for various power supply configurations.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easy alignment during assembly.

Bit Size: 16

16-bit processing capability enables faster and more complex operations compared to lower-bit processors.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enables flexibility in use across different applications.

No. of Terminals: 100

Ample terminals provide connectivity options and interface capabilities with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enhances space efficiency and minimizes signal interference.

Minimum Supply Voltage: 1.8 V

Ability to function effectively at low supply voltages conserves power and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption, making it suitable for battery-powered applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, expanding its usability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold finish ensures high conductivity, corrosion resistance, and longevity of terminal connections.

ADC Channels: YES

Built-in ADC channels enable analog to digital conversion for precise sensing and processing of real-world signals.

Terminal Position: QUAD

Quad terminal configuration facilitates stable and secure connections to the external circuitry.

ROM Words: 262144

Large ROM capacity allows for extensive program storage, accommodating complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low profile design with compact height conserves space and enables sleek product designs.

RAM Words: 16

Sufficient RAM storage for temporary data retention during processing, supporting multitasking capabilities.

Width: 14 mm

Compact width dimension facilitates integration in space-constrained electronic devices.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for rapid data processing and execution of instructions, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Supports efficient soldering process with specified time duration for peak reflow temperature exposure.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and secure connections during assembly.

Length: 14 mm

Optimal length dimension for compatible placement on circuit boards and streamlined product layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated microprocessor circuit enhances system functionality with peripheral components for diverse applications.

RAM Bytes: 16384

Generous RAM capacity in bytes facilitates efficient data storage and manipulation during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and easy soldering during assembly.

Maximum Supply Current: 11.75 mA

Low supply current consumption ensures energy efficiency and prolongs battery life in portable applications.

Nominal Supply Voltage: 3.3 V

Stable and standard nominal supply voltage for consistent and reliable performance in various operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and modifications.

Bus Compatibility: I2C; SPI; UART

Compatibility with popular bus interfaces enables seamless communication and data exchange with external devices.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enhances packing density on circuit boards and enables compact device design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard handling procedures during storage and assembly.

Speed: 25 rpm

Operates at a speed of 25 rpm, suitable for various timing and control applications in electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6746IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6746IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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