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MSP430F6745IPZ

Texas Instruments

MSP430F6745IPZ by Texas Instruments

MSP430F6745IPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at a max frequency of 25 MHz, it is ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this MCU offers versatile connectivity options in a compact flatpack package.

Median Price

$6.915

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 650 parts In-Stock

1+ parts

$6.915

100+ parts

$5.637

1k+ parts

$3.758

10k+ parts

-

650

$6.915

$5.637

$3.758

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,818 parts In-Stock

1+ parts

$6.569

100+ parts

-

1k+ parts

-

10k+ parts

-

4,818

$6.569

-

-

-

Vyrian

USA . 7,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,673

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 469 parts In-Stock

1+ parts

$6.224

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$6.224

-

-

-

Corohmni

South Africa . 33 parts In-Stock

1+ parts

$6.548

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$6.548

-

-

-

AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$12.440

100+ parts

-

1k+ parts

-

10k+ parts

-

524

$12.440

-

-

-

Microchip USA

USA . 1,732 parts In-Stock

1+ parts

$18.920

100+ parts

$18.650

1k+ parts

$18.510

10k+ parts

$18.380

1,732

$18.920

$18.650

$18.510

$18.380

Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$45.126

100+ parts

-

1k+ parts

-

10k+ parts

-

1,380

$45.126

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-

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DigiPath Technology Company

USA . 344 parts In-Stock

1+ parts

$49.689

100+ parts

$45.714

1k+ parts

-

10k+ parts

-

344

$49.689

$45.714

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-

ChromeModa Solutions

Germany . 3,621 parts In-Stock

1+ parts

$50.703

100+ parts

$41.576

1k+ parts

-

10k+ parts

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3,621

$50.703

$41.576

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IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$50.703

100+ parts

$48.168

1k+ parts

$45.633

10k+ parts

-

9

$50.703

$48.168

$45.633

-

Overview

Unlock the power of innovation with the MSP430F6745IPZ from Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With its advanced technology and industrial-grade design, this product ensures seamless operation in any environment. Experience the benefits of superior quality, efficiency, and versatility with the MSP430F6745IPZ, setting a new standard in functionality and value for customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, making it versatile for various power requirements.

Package Shape: SQUARE

Square package shape allows for better space utilization on PCBs.

Bit Size: 16

16-bit architecture provides enhanced computational capabilities.

Power Supplies (V): 2/3.3

Supports multiple power supply voltages, offering flexibility in design.

No. of Terminals: 100

100 terminals provide ample connectivity options for peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables compact and space-saving designs.

Minimum Supply Voltage: 1.8 V

Supports a low minimum supply voltage of 1.8V for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C suitable for industrial applications.

CPU Family: MSP430

Uses MSP430 CPU family known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Operates reliably at low temperatures down to -40°C, suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures high conductivity and corrosion resistance.

ADC Channels: YES

Integrated ADC channels for analog signal processing and conversion.

Terminal Position: QUAD

Quad terminal position for improved stability and robustness.

ROM Words: 131072

Large ROM capacity of 131072 words for program and data storage.

Maximum Seated Height: 1.6 mm

Low profile with a maximum seated height of 1.6mm for space-constrained applications.

RAM Words: 16

16 RAM words for temporary data storage and processing.

Width: 14 mm

Compact width of 14mm for easy integration into tight layouts.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25MHz for rapid data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during soldering processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C for reliable solder connections.

Length: 14 mm

Compact length of 14mm for space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for robust performance in demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates microprocessor circuitry for versatile peripheral connectivity and control.

RAM Bytes: 16384

16384 RAM bytes for efficient data handling and multitasking.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections.

Maximum Supply Current: 11.75 mA

Low maximum supply current of 11.75mA for energy-efficient usage.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V for consistent performance.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and customization.

Bus Compatibility: I2C; SPI; UART

Multiple bus compatibility (I2C, SPI, UART) for versatile connectivity options.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for compact and reliable connections.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, suitable for standard handling and storage.

Speed: 25 rpm

Operates at a speed of 25 rpm for efficient data processing and communication.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6745IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6745IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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