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MSP430F6745AIPZ

Texas Instruments

MSP430F6745AIPZ by Texas Instruments

MSP430F6745AIPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.684

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

740

$7.684

$6.264

$4.176

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 921 parts In-Stock

1+ parts

$7.300

100+ parts

-

1k+ parts

-

10k+ parts

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921

$7.300

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Vyrian

USA . 4,389 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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4,389

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,476 parts In-Stock

1+ parts

$6.916

100+ parts

-

1k+ parts

-

10k+ parts

-

4,476

$6.916

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-

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Corohmni

South Africa . 203 parts In-Stock

1+ parts

$7.760

100+ parts

-

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10k+ parts

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203

$7.760

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Microchip USA

USA . 2,867 parts In-Stock

1+ parts

$21.020

100+ parts

$20.720

1k+ parts

$20.570

10k+ parts

$20.420

2,867

$21.020

$20.720

$20.570

$20.420

AZTECH Wire

Italy . 61 parts In-Stock

1+ parts

$22.160

100+ parts

-

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-

10k+ parts

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61

$22.160

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Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

$40.034

100+ parts

$3,717.762

1k+ parts

$36.031

10k+ parts

-

2,303

$40.034

$3,717.762

$36.031

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DigiPath Technology Company

USA . 1,221 parts In-Stock

1+ parts

$44.082

100+ parts

-

1k+ parts

-

10k+ parts

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1,221

$44.082

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ChromeModa Solutions

Germany . 4,815 parts In-Stock

1+ parts

$44.982

100+ parts

$36.885

1k+ parts

-

10k+ parts

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4,815

$44.982

$36.885

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IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$44.982

100+ parts

$42.733

1k+ parts

$40.484

10k+ parts

-

1,094

$44.982

$42.733

$40.484

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Component Stockers USA

USA . 542 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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542

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Overview

Unleash the power of Texas Instruments with the MSP430F6745AIPZ, a top-of-the-line microprocessor circuit designed to take your projects to the next level. With cutting-edge technology and industrial-grade quality, this versatile device offers seamless connectivity and advanced features like analog to digital converters and PWM channels. Whether you're working on IoT devices, smart sensors, or industrial automation, the MSP430F6745AIPZ delivers unmatched performance and reliability. Elevate your designs with Texas Instruments and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and durable, suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various power sources.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the functionality and processing capabilities of the product, making it versatile for different tasks.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the product to interact with the analog world and process real-world signals.

DMA Channels: YES

Having DMA channels helps improve data transfer efficiency and offloads the CPU from handling data transfer tasks, enhancing overall system performance.

ROM Programmability: FLASH

The use of flash ROM for programmability offers flexibility in updating and storing program codes, allowing for easy firmware upgrades and customization.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

With multiple connectivity options such as I2C, IRDA, SPI, and UART, the product can easily interface with other devices and communicate efficiently in various networks.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6745AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6745AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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