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MSP430F67451IPZR

Texas Instruments

MSP430F67451IPZR by Texas Instruments

MSP430F67451IPZR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85°C, it has a max supply voltage of 3.6V and consumes up to 11.75mA. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,326 parts In-Stock

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Digiode

USA . 1,764 parts In-Stock

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1,764

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Distributors (Availability)

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One Stop Electronics

USA . 907 parts In-Stock

1+ parts

$1.000

100+ parts

-

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907

$1.000

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AZTECH Wire

Italy . 830 parts In-Stock

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$17.110

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830

$17.110

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Microchip USA

USA . 355 parts In-Stock

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$30.110

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$29.920

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$29.830

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$29.740

355

$30.110

$29.920

$29.830

$29.740

Parana Technologies

USA . 1,070 parts In-Stock

1+ parts

$45.309

100+ parts

$4,207.629

1k+ parts

$40.778

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1,070

$45.309

$4,207.629

$40.778

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Corohmni

South Africa . 199 parts In-Stock

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$46.439

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199

$46.439

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DigiPath Technology Company

USA . 2,319 parts In-Stock

1+ parts

$49.891

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$45.900

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2,319

$49.891

$45.900

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$50.909

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$48.364

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$45.818

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1,816

$50.909

$48.364

$45.818

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ChromeModa Solutions

Germany . 1,162 parts In-Stock

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$50.909

100+ parts

$41.745

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1,162

$50.909

$41.745

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Component Stockers USA

USA . 515 parts In-Stock

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$99.990

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515

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,216 parts In-Stock

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Corphita

USA . 3,008 parts In-Stock

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Overview

Experience the next level of performance and reliability with the MSP430F67451IPZR by Texas Instruments. As a trusted leader in semiconductor manufacturing, Texas Instruments delivers top-quality products that exceed industry standards. This versatile microprocessor circuit is ideal for a wide range of applications, offering customers unparalleled value and benefits. With its cutting-edge technology and innovative design, the MSP430F67451IPZR provides superior functionality and efficiency, making it the perfect choice for all your electronic needs. Elevate your projects with this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection for the internal components of the IC, making it durable and reliable.

Max Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this IC can handle a wide range of power inputs, increasing its versatility.

Bit Size: 16

The 16-bit architecture allows for more complex operations and calculations, making this IC suitable for a variety of applications.

CPU Family: MSP430

Being part of the MSP430 CPU family means that this IC benefits from the low power consumption and high performance features associated with this family of microcontrollers.

ROM Words: 131072

With a large ROM capacity of 131072 words, this IC can store a significant amount of program data, allowing for more advanced functionality.

RAM Bytes: 16384

The 16384 bytes of RAM provide ample space for temporary data storage and quick access, enhancing the performance of the IC.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this IC energy efficient and responsive.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67451IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67451IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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