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MSP430F67451AIPEU

Texas Instruments

MSP430F67451AIPEU by Texas Instruments

MSP430F67451AIPEU by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.458

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 969 parts In-Stock

1+ parts

$8.644

100+ parts

$7.047

1k+ parts

$4.698

10k+ parts

-

969

$8.644

$7.047

$4.698

-

Arrow

USA . 864 parts In-Stock

1+ parts

-

100+ parts

$6.272

1k+ parts

-

10k+ parts

-

864

-

$6.272

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,959 parts In-Stock

1+ parts

$8.212

100+ parts

-

1k+ parts

-

10k+ parts

-

3,959

$8.212

-

-

-

Vyrian

USA . 7,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,700

-

-

-

-

TME

Poland . 864 parts In-Stock

1+ parts

-

100+ parts

$6.219

1k+ parts

-

10k+ parts

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864

-

$6.219

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,944 parts In-Stock

1+ parts

$7.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$7.780

-

-

-

AZTECH Wire

Italy . 1,178 parts In-Stock

1+ parts

$9.400

100+ parts

-

1k+ parts

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10k+ parts

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1,178

$9.400

-

-

-

Parana Technologies

USA . 1,653 parts In-Stock

1+ parts

$58.477

100+ parts

-

1k+ parts

-

10k+ parts

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1,653

$58.477

-

-

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DigiPath Technology Company

USA . 769 parts In-Stock

1+ parts

$64.390

100+ parts

$59.239

1k+ parts

-

10k+ parts

-

769

$64.390

$59.239

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-

ChromeModa Solutions

Germany . 6,342 parts In-Stock

1+ parts

$65.704

100+ parts

$53.877

1k+ parts

-

10k+ parts

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6,342

$65.704

$53.877

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IDEA Electronic Components Group

UK . 999 parts In-Stock

1+ parts

$65.704

100+ parts

$62.419

1k+ parts

$59.134

10k+ parts

-

999

$65.704

$62.419

$59.134

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Corohmni

South Africa . 10 parts In-Stock

1+ parts

$78.701

100+ parts

-

1k+ parts

-

10k+ parts

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10

$78.701

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,265 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,265

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F67451AIPEU. As a leader in semiconductor technology, Texas Instruments delivers unmatched quality and reliability in every product. The MSP430F67451AIPEU belongs to the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With its advanced features and cutting-edge technology, this microprocessor circuit provides customers with exceptional value and performance. Experience the benefits of high-speed connectivity, precision analog-to-digital conversion, and versatile PWM channels. Elevate your designs with the Texas Instruments MSP430F67451AIPEU and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package light-weight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage provides flexibility in power supply options for different system requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, optimizing the overall design layout.

Bit Size: 16

A 16-bit architecture enables higher processing capabilities and precision in data manipulation.

No. of Terminals: 128

The abundance of terminals allows for versatile connectivity options and integration with other components in the system.

Minimum Supply Voltage: 2.4 V

Support for a low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in challenging environmental conditions.

CPU Family: MSP430

The MSP430 family is known for its low-power consumption and high performance, making it a popular choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for operation in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the product suitable for sensor interfacing and data conversion.

DMA Channels: YES

DMA channels streamline data transfer operations, improving system efficiency and performance in data-intensive applications.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program code, enabling complex algorithms and functions to be implemented.

RAM Words: 16

Although small in size, the onboard RAM provides temporary storage for data processing, enhancing the speed and efficiency of the system.

Width: 14 mm

A compact width dimension facilitates space-saving design considerations and enables integration into smaller form factor devices.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Multiple peripherals enhance the product's capabilities and versatility, enabling a wide range of functions and applications.

Maximum Clock Frequency: 0.032768 MHz

The maximum clock frequency determines the processing speed of the product, ensuring efficient execution of tasks within the specified limits.

Peak Reflow Temperature: 260 C

The peak reflow temperature specification ensures reliable solder joint formation during the manufacturing process, contributing to product quality and durability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes the product suitable for demanding industrial applications where temperature variations are common.

Analog To Digital Convertors: 6-Ch 10-Bit

The availability of multiple ADC channels with 10-bit resolution enables accurate analog signal conversion for precise data acquisition.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent performance and reliable operation of the product under normal operating conditions.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Various connectivity options such as I2C, IRDA, SPI, and UART enable seamless communication with other devices and peripherals, enhancing system integration capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming of the ROM contents, enabling firmware updates and customization without the need for specialized equipment.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols enhances interoperability and compatibility with different communication interfaces, making the product versatile and adaptable.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture exposure during storage and handling, requiring standard precautions for moisture protection.

No. of I/O Lines: 90

A high number of I/O lines offer extensive input/output capabilities, enabling versatile external connections and data exchange with external devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67451AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67451AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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