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LM4F111C4QRFIGR

Texas Instruments

LM4F111C4QRFIGR by Texas Instruments

LM4F111C4QRFIGR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features a Cortex-M4F CPU family, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,303 parts In-Stock

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2,303

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Digiode

USA . 516 parts In-Stock

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516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 232 parts In-Stock

1+ parts

$19.319

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232

$19.319

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One Stop Electronics

USA . 672 parts In-Stock

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$28.000

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672

$28.000

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Parana Technologies

USA . 1,258 parts In-Stock

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$53.383

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$53.383

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DigiPath Technology Company

USA . 618 parts In-Stock

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$58.781

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618

$58.781

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IDEA Electronic Components Group

UK . 2,265 parts In-Stock

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$59.981

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$56.982

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$53.983

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2,265

$59.981

$56.982

$53.983

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ChromeModa Solutions

Germany . 877 parts In-Stock

1+ parts

$59.981

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$49.184

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877

$59.981

$49.184

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Corphita

USA . 4,358 parts In-Stock

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Overview

Enhance your electronic projects with the LM4F111C4QRFIGR by Texas Instruments, a top-tier microcontroller designed to deliver unparalleled performance and reliability. With a cutting-edge Cortex-M4F CPU family, this microcontroller offers 32-bit processing power, along with advanced features like ADC and DMA channels for seamless integration into various applications. The industrial-grade temperature range ensures durability, while the compact package style and low profile design make it ideal for space-constrained projects. Trust in Texas Instruments’ superior quality and innovation to bring your designs to life with the LM4F111C4QRFIGR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for applications where weight and reliability are key factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage capability provides flexibility and compatibility with various power sources, ensuring reliable operation.

Bit Size: 32

The 32-bit architecture allows for fast and efficient processing of data, making this microcontroller suitable for tasks that require high computational power.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options allows for versatile usage in different applications, providing flexibility in power management.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables compact and space-saving designs, crucial for applications where size constraints are a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller is suitable for industrial environments where temperature fluctuations are common.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family provides high performance and energy efficiency, making this microcontroller well-suited for applications that demand both processing power and low power consumption.

RAM Bytes: 24576

The ample RAM capacity of 24576 bytes allows for efficient data storage and processing, enabling the microcontroller to handle complex tasks without performance bottlenecks.

Technical Specifications

Microcontrollers LM4F111C4QRFIGR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM4F111C4QRFIGR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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